公开(公告)号：US09354273B2

公开(公告)日：2016-05-31

申请号：US13725255

申请日：2012-12-21

Applicant: Intel Corporation

Inventor： Kip Stevenson ,  Todd P. Albertson ,  David Shia ,  Kamil Salloum

IPC: G01R31/28 ,  G01R3/00 ,  G01R1/067

CPC classification number: G01R1/06755 ,  G01R3/00 ,  G01R31/26 ,  G01R31/2886

Abstract: An examples includes a substrate, including a conductive trace and a layer disposed on top of the conductive trace, the layer defining at least one cavity extending to the conductive trace and an electrical probe disposed in the cavity, with solder coupling the electrical probe to the conductive trace. The electrical probe can include a high yield strength wire core including a refractory metal and a thin oxidation protection layer concentrically disposed around high yield strength wire core and providing an outside surface of the electrical probe, the thin oxidation protection layer including predominantly one or more materials selected from gold, platinum, ruthenium, rhodium, palladium, osmium, iridium, chromium, and combinations thereof, wherein the solder fills the cavity and is coupled to the electrical probe inside the cavity, disposed between the electrical probe and the layer.

Abstract translation: 示例包括基板，其包括导电迹线和设置在导电迹线顶部上的层，该层限定延伸到导电迹线的至少一个空腔和设置在该空腔中的电探针，焊料将电探针耦合到 导电痕迹 电探针可以包括高屈服强度的线芯，包括耐火金属和同心地设置在高屈服强度线芯周围的薄氧化保护层，并提供电探针的外表面，薄氧化保护层主要包括一种或多种材料 选自金，铂，钌，铑，钯，锇，铱，铬及其组合，其中焊料填充空腔并且耦合到设置在电探针和层之间的腔内的电探针。

公开(公告)号：US20160274148A1

公开(公告)日：2016-09-22

申请号：US15165984

申请日：2016-05-26

Applicant: Intel Corporation

Inventor： Kip Stevenson ,  Todd P. Albertson ,  David Shia ,  Kamil Salloum

IPC: G01R1/067 ,  G01R31/26

CPC classification number: G01R1/06755 ,  G01R3/00 ,  G01R31/26 ,  G01R31/2886

Abstract: An examples includes a substrate, including a conductive trace and a layer disposed on top of the conductive trace, the layer defining at least one cavity extending to the conductive trace and an electrical probe disposed in the cavity, with solder coupling the electrical probe to the conductive trace. The electrical probe can include a high yield strength wire core including a refractory metal and a thin oxidation protection layer concentrically disposed around high yield strength wire core and providing an outside surface of the electrical probe, the thin oxidation protection layer including predominantly one or more materials selected from gold, platinum, ruthenium, rhodium, palladium, osmium, iridium, chromium, and combinations thereof, wherein the solder fills the cavity and is coupled to the electrical probe inside the cavity, disposed between the electrical probe and the layer.

Abstract translation: 示例包括基板，其包括导电迹线和设置在导电迹线顶部上的层，该层限定延伸到导电迹线的至少一个空腔和设置在该空腔中的电探针，其中焊料将电探针耦合到 导电痕迹 电探针可以包括高屈服强度的线芯，包括耐火金属和同心地设置在高屈服强度线芯周围的薄氧化保护层，并提供电探针的外表面，薄氧化保护层主要包括一种或多种材料 选自金，铂，钌，铑，钯，锇，铱，铬及其组合，其中焊料填充空腔并且耦合到设置在电探针和层之间的腔内的电探针。