公开(公告)号：US20160187927A1

公开(公告)日：2016-06-30

申请号：US14583045

申请日：2014-12-24

Applicant: Intel Corporation

Inventor： MARK A. MACDONALD ,  YOSHIFUMI NISHI

IPC: G06F1/16 ,  H05K7/20 ,  G06F1/20

CPC classification number: G06F1/1632 ,  G06F1/203 ,  G06F1/206 ,  H05K7/20154

Abstract: Methods and apparatus relating for direct attach dock cooling leveraging Maximum Silicon Junction Temperature (Tj) control are described. In an embodiment, performance of a mobile computing device is increased based at least in part on an indication that the mobile computing device is coupled to a dock. The dock includes a cooling fan proximate to a hotspot on a back skin of the mobile computing device. Other embodiments are also disclosed and claimed.

Abstract translation: 描述了使用最大硅结温（Tj）控制的直接连接坞冷却的方法和设备。 在一个实施例中，至少部分地基于移动计算设备耦合到坞站的指示来增加移动计算设备的性能。 码头包括靠近移动计算设备的背部皮肤上的热点的冷却风扇。 还公开并要求保护其他实施例。