公开(公告)号：US20160179147A1

公开(公告)日：2016-06-23

申请号：US14580036

申请日：2014-12-22

Applicant: Intel Corporation

Inventor： JEREMY BURR ,  DAVID W. BROWNING ,  SHAWN S. MCEUEN ,  MARK MACDONALD ,  MATTHEW D. COAKLEY

IPC: G06F1/20

CPC classification number: G06F1/203 ,  G06F1/1632 ,  G06F1/206

Abstract: In one example a electronic device comprises a housing, at least one heat generating component disposed within the housing, at least one internal heat dissipation device positioned proximate the at least one heat generating component, and a thermal interface defined in at least a portion of the housing to allow direct thermal contact between the heat dissipation device and an external heat dissipation device. Other examples may be described.

Abstract translation: 在一个示例中，电子设备包括壳体，设置在壳体内的至少一个发热部件，至少一个靠近至少一个发热部件定位的内部散热装置，以及限定在至少一部分 壳体，以允许散热装置和外部散热装置之间的直接热接触。 可以描述其他示例。

公开(公告)号：US20180173283A1

公开(公告)日：2018-06-21

申请号：US15665873

申请日：2017-08-01

Applicant: Intel Corporation

Inventor： JEREMY BURR ,  DAVID W. BROWNING ,  SHAWN S. MCEUEN ,  MARK MACDONALD ,  MATTHEW D. COAKLEY

IPC: G06F1/20 ,  G06F1/16

Abstract: In one example a electronic device comprises a housing, at least one heat generating component disposed within the housing, at least one internal heat dissipation device positioned proximate the at least one heat generating component, and a thermal interface defined in at least a portion of the housing to allow direct thermal contact between the heat dissipation device and an external heat dissipation device. Other examples may be described.