NON-METALLIC VAPOR CHAMBERS
    1.
    发明申请

    公开(公告)号:US20170160017A1

    公开(公告)日:2017-06-08

    申请号:US14959010

    申请日:2015-12-04

    Inventor: MARK MACDONALD

    CPC classification number: F28D15/046 F28F21/067 H01L23/427

    Abstract: A non-metallic vapor chamber includes a composite wick structure that fills a non-metallic housing. The composite wick structure provides mechanical strength and structural rigidity to the non-metallic vapor chamber. The composite wick structure includes a first hydrophilic wick portion and a second hydrophobic wick portion. A condensed working fluid flows through the first hydrophilic wick portion from a condensation region to a region proximate one or more thermal energy producing devices. A vaporized working fluid flows through the second hydrophobic wick portion from the region proximate one or more thermal energy producing devices to a condensation region where the vaporized working fluid is condensed for reuse.

    BELT DRIVEN HINGE ASSEMBLY FOR ELECTRONIC DEVICES
    6.
    发明申请
    BELT DRIVEN HINGE ASSEMBLY FOR ELECTRONIC DEVICES 有权
    皮带驱动的电子装置的铰链总成

    公开(公告)号:US20150378400A1

    公开(公告)日:2015-12-31

    申请号:US14318257

    申请日:2014-06-27

    CPC classification number: G06F1/1681 G06F1/1616 H04M1/022

    Abstract: In one example an electronic device comprises a controller, a chassis comprising a first section and a second section, and a hinge assembly to connect the first section of the chassis to the second section of the chassis comprising a housing, a first shaft rotatable about a first axis, a second shaft rotatable about a second axis, a belt drive assembly to couple the first shaft to the second shaft, and a tension assembly to apply a tension to the belt drive assembly. Other examples may be described.

    Abstract translation: 在一个示例中,电子设备包括控制器,包括第一部分和第二部分的底架以及将底盘的第一部分连接到底架的第二部分的铰链组件,包括壳体,第一轴可绕 第一轴线,可围绕第二轴线旋转的第二轴线,将第一轴部连接到第二轴线的带驱动组件以及将张力施加到带驱动组件的张力组件。 可以描述其他示例。

    DYNAMIC THERMAL PLATFORM OPERATING POINT FOR ELECTRONIC DEVICES
    7.
    发明申请
    DYNAMIC THERMAL PLATFORM OPERATING POINT FOR ELECTRONIC DEVICES 有权
    用于电子设备的动态热平台操作点

    公开(公告)号:US20160179147A1

    公开(公告)日:2016-06-23

    申请号:US14580036

    申请日:2014-12-22

    CPC classification number: G06F1/203 G06F1/1632 G06F1/206

    Abstract: In one example a electronic device comprises a housing, at least one heat generating component disposed within the housing, at least one internal heat dissipation device positioned proximate the at least one heat generating component, and a thermal interface defined in at least a portion of the housing to allow direct thermal contact between the heat dissipation device and an external heat dissipation device. Other examples may be described.

    Abstract translation: 在一个示例中,电子设备包括壳体,设置在壳体内的至少一个发热部件,至少一个靠近至少一个发热部件定位的内部散热装置,以及限定在至少一部分 壳体,以允许散热装置和外部散热装置之间的直接热接触。 可以描述其他示例。

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