公开(公告)号：US20240104043A1

公开(公告)日：2024-03-28

申请号：US17950840

申请日：2022-09-22

Applicant: Intel Corporation

Inventor： Shailendra Singh Chauhan ,  Nirmala Bailur ,  Reza M. Zamani ,  Jackson Chung Peng Kong ,  Charuhasini Sunder Raman ,  Venkataramani Gopalakrishnan ,  Chuen Ming Tan ,  Sreejith Satheesakurup ,  Karthi Kaliswamy ,  Venkata Mahesh Gunnam ,  Yi Jen Huang ,  Kie Woon Lim ,  Dhinesh Sasidaran ,  Pik Shen Chee ,  Venkataramana Kotakonda ,  Kunal A. Shah ,  Ramesh Vankunavath ,  Siva Prasad Jangili Ganga ,  Ravali Pampala ,  Uma Medepalli ,  Tomer Savariego ,  Naznin Banu Wahab ,  Sindhusha Kodali ,  Manjunatha Venkatarauyappa ,  Surendar Jeevarathinam ,  Madhura Shetty ,  Deepak Sharma ,  Rohit Sharad Mahajan

IPC: G06F13/40 ,  G06F13/42

CPC classification number: G06F13/4045 ,  G06F13/4068 ,  G06F13/4282 ,  G06F2213/0026 ,  G06F2213/0042

Abstract: Embodiments herein relate to a module which can be inserted into or removed from a computing device by a user. The module includes an input-output port which is configured for a desired specification, such as USB-A, USB-C, Thunderbolt, DisplayPort or HDMI. The port can be provided on an expansion card such as an M.2 card for communicating with a host platform. The host platform can communicate with different types of modules in a standardized way so that complexity and costs are reduced. In another aspect, with a dual port module, the host platform can concurrently send/receive power through one port and send/receive data from the other port.