公开(公告)号：US20240312819A1

公开(公告)日：2024-09-19

申请号：US18185427

申请日：2023-03-17

Applicant: Intel Corporation

Inventor： Hong Seung YEON ,  Mariano PHIELIPP ,  Yi LI ,  Minglu LIU ,  Robin McREE ,  Yosuke KANAOKA ,  Gang DUAN

IPC: H01L21/68 ,  H01L21/67

CPC classification number: H01L21/68 ,  H01L21/67259

Abstract: A method for real-time offset adjustment of a semiconductor die placement comprising: obtaining or receiving operational parameters of a die mounting tool in real-time, wherein the die mounting tool is configured for placing the semiconductor die on a panel; predicting an offset adjustment of the semiconductor die placement based on the operational parameters; and determining semiconductor die placement coordinates based on an original die placement and the offset adjustment.