公开(公告)号：US10651108B2

公开(公告)日：2020-05-12

申请号：US15197440

申请日：2016-06-29

申请人： Intel Corporation

发明人： Zhizhong Tang ,  Syadwad Jain ,  Wei Hu ,  Michael A. Schroeder ,  Rajen S. Sidhu ,  Carl L. Deppisch ,  Patrick Nardi ,  Kelly P. Lofgreen ,  Manish Dubey

IPC分类号： H05K5/00 ,  H01L23/373 ,  H01L23/498 ,  H01L23/00 ,  H01L23/42 ,  F28F13/00 ,  F28F21/04 ,  F28F21/02 ,  F28F21/08 ,  F28D21/00

摘要： Devices and methods disclosed herein can include a conductive foam having pores disposed within the conductive foam. The conductive foam can be compressible between an uncompressed thickness and a compressed thickness. The compressed thickness can be ninety-five percent or less of the uncompressed thickness. In one example, a filler can be disposed in the pores of the conductive foam. The filler can include a first thermal conductivity. The first thermal conductivity can be greater than a thermal conductivity of air.

公开(公告)号：US11609614B2

公开(公告)日：2023-03-21

申请号：US16639714

申请日：2017-09-20

申请人： Intel Corporation

发明人： Ali Moradi ,  Joseph B. Petrini ,  Michael A. Schroeder ,  Shankar Devansenathipathy ,  Atul N. Hatalkar

IPC分类号： G06F1/16 ,  H05K5/00 ,  H05K7/00 ,  G01S7/481 ,  G06F1/20 ,  H05K7/20

摘要： Embodiments include apparatuses, systems and methods for a computer device with a casing and a substance in the casing substantially surrounding a computer component in the casing. In embodiments, the computer device may be a command and control computer, such as for example, an autonomous or semi-autonomous vehicle. In embodiments, the substance may be an electrically isolative and shear-thickening fluid to provide thermo-mechanical protection to a computer component. In the described embodiments, the substance may dampen mechanical shock or vibrational impact on the processor and the memory. The shear-thickening gel may further be thermally conductive in embodiments. In the embodiments, the casing may be substantially filled with the substance and the substance is to conduct heat away from the processor and the memory toward an outer edge of the casing. Other embodiments may also be described and claimed.