公开(公告)号：US11609614B2

公开(公告)日：2023-03-21

申请号：US16639714

申请日：2017-09-20

Applicant: Intel Corporation

Inventor： Ali Moradi ,  Joseph B. Petrini ,  Michael A. Schroeder ,  Shankar Devansenathipathy ,  Atul N. Hatalkar

IPC: G06F1/16 ,  H05K5/00 ,  H05K7/00 ,  G01S7/481 ,  G06F1/20 ,  H05K7/20

Abstract: Embodiments include apparatuses, systems and methods for a computer device with a casing and a substance in the casing substantially surrounding a computer component in the casing. In embodiments, the computer device may be a command and control computer, such as for example, an autonomous or semi-autonomous vehicle. In embodiments, the substance may be an electrically isolative and shear-thickening fluid to provide thermo-mechanical protection to a computer component. In the described embodiments, the substance may dampen mechanical shock or vibrational impact on the processor and the memory. The shear-thickening gel may further be thermally conductive in embodiments. In the embodiments, the casing may be substantially filled with the substance and the substance is to conduct heat away from the processor and the memory toward an outer edge of the casing. Other embodiments may also be described and claimed.