公开(公告)号：US20210305196A1

公开(公告)日：2021-09-30

申请号：US16828651

申请日：2020-03-24

Applicant: Intel Corporation

Inventor： Morten JENSEN ,  Michael RYAN ,  Srikant NEKKANTY ,  Joe F. WALCZYK

IPC: H01L23/00 ,  H01R13/24 ,  H01R12/71

Abstract: An interconnect that has an electrically conductive layer, where a first and second insulator layers are coupled with the conductive layer. A region of the conductive layer includes an opening of a portion of the first insulator layer the second insulator layer that are adjacent to the region. An electrical connector of a first device is electrically coupled to a portion of the region on a first side of the conductive layer and an electrical conductor of a second device is electrically coupled with a portion of the region on the second side. Also, an interconnect coupled with a substrate that includes a cylinder extending from a side of the substrate with a plate coupled at the end of the cylinder with an opening that includes two or more tabs of the plate extending into the opening to receive a connector.