公开(公告)号：US11251171B2

公开(公告)日：2022-02-15

申请号：US16007867

申请日：2018-06-13

Applicant: Intel Corporation

Inventor： Michael Rifani ,  Robert J. Munoz ,  Thomas P. Thomas ,  John Mark Matson ,  Kursad Kiziloglu

IPC: H01L25/18 ,  H01L23/32 ,  G02B6/12 ,  H01L23/538

Abstract: Embodiments may relate to a substrate for use in a system in package (SIP). The substrate may include a first couple to couple with a first component via a permanent couple such that the first component is communicatively coupled with a bridge. The substrate may further include a second couple to removably couple with an interposer such that the interposer is communicatively coupled with the bridge via a communicative couple. Other embodiments may be described or claimed.

公开(公告)号：US20190385994A1

公开(公告)日：2019-12-19

申请号：US16007867

申请日：2018-06-13

Applicant: Intel Corporation

Inventor： Michael Rifani ,  Robert J. Munoz ,  Thomas P. Thomas ,  John Mark Matson ,  Kursad Kiziloglu

IPC: H01L25/18 ,  H01L23/32 ,  H01L23/538 ,  G02B6/12

Abstract: Embodiments may relate to a substrate for use in a system in package (SIP). The substrate may include a first couple to couple with a first component via a permanent couple such that the first component is communicatively coupled with a bridge. The substrate may further include a second couple to removably couple with an interposer such that the interposer is communicatively coupled with the bridge via a communicative couple. Other embodiments may be described or claimed.