公开(公告)号：US11251171B2

公开(公告)日：2022-02-15

申请号：US16007867

申请日：2018-06-13

Applicant: Intel Corporation

Inventor： Michael Rifani ,  Robert J. Munoz ,  Thomas P. Thomas ,  John Mark Matson ,  Kursad Kiziloglu

IPC: H01L25/18 ,  H01L23/32 ,  G02B6/12 ,  H01L23/538

Abstract: Embodiments may relate to a substrate for use in a system in package (SIP). The substrate may include a first couple to couple with a first component via a permanent couple such that the first component is communicatively coupled with a bridge. The substrate may further include a second couple to removably couple with an interposer such that the interposer is communicatively coupled with the bridge via a communicative couple. Other embodiments may be described or claimed.

公开(公告)号：US10374419B2

公开(公告)日：2019-08-06

申请号：US15043370

申请日：2016-02-12

Applicant: Intel Corporation

Inventor： Todd W. Mellinger ,  Michael E. Griffith ,  Ganesh Balamurugan ,  Thomas P. Thomas

IPC: H02H9/04 ,  H01L27/02 ,  H03K19/003 ,  G06F1/16

Abstract: An on-package interface. A first set of single-ended transmitter circuits on a first die. A first set of single-ended receiver circuits on a second die. The receiver circuits have a termination circuit comprising an inverter and a resistive feedback element. A plurality of conductive lines couple the first set of transmitter circuits and the first set of receiver circuits. The lengths of the plurality of conductive lines are matched.

公开(公告)号：US20190385994A1

公开(公告)日：2019-12-19

申请号：US16007867

申请日：2018-06-13

Applicant: Intel Corporation

Inventor： Michael Rifani ,  Robert J. Munoz ,  Thomas P. Thomas ,  John Mark Matson ,  Kursad Kiziloglu

IPC: H01L25/18 ,  H01L23/32 ,  H01L23/538 ,  G02B6/12

Abstract: Embodiments may relate to a substrate for use in a system in package (SIP). The substrate may include a first couple to couple with a first component via a permanent couple such that the first component is communicatively coupled with a bridge. The substrate may further include a second couple to removably couple with an interposer such that the interposer is communicatively coupled with the bridge via a communicative couple. Other embodiments may be described or claimed.

公开(公告)号：US20160164281A1

公开(公告)日：2016-06-09

申请号：US15043370

申请日：2016-02-12

Applicant: Intel Corporation

Inventor： Todd W. Mellinger ,  Michael E. Griffith ,  Ganesh Balamurugan ,  Thomas P. Thomas

IPC: H02H9/04 ,  G06F1/16 ,  H03K19/003 ,  H01L27/02

CPC classification number: H02H9/046 ,  G06F1/16 ,  G06F1/1613 ,  H01L27/0255 ,  H03K19/00361

Abstract: An on-package interface. A first set of single-ended transmitter circuits on a first die. A first set of single-ended receiver circuits on a second die. The receiver circuits have a termination circuit comprising an inverter and a resistive feedback element. A plurality of conductive lines couple the first set of transmitter circuits and the first set of receiver circuits. The lengths of the plurality of conductive lines are matched.

Abstract translation: 一个封装接口。 第一组第一组单端发射机电路。 第二组芯片上的第一组单端接收器电路。 接收器电路具有包括反相器和电阻反馈元件的终端电路。 多条导线耦合第一组发射机电路和第一组接收机电路。 多条导线的长度相匹配。