公开(公告)号：US20200304215A1

公开(公告)日：2020-09-24

申请号：US16893660

申请日：2020-06-05

Applicant: Intel Corporation

Inventor： Diego Correas-Serrano ,  Georgios Dogiamis ,  Henning Braunisch ,  Neelam Prabhu-Gaunkar ,  Telesphor Kamgaing ,  Thomas W. Brown ,  Stefano Pellerano

IPC: H04B15/00 ,  H04L25/03

Abstract: Embodiments may relate to a communications module comprising with a dispersion compensation module communicatively coupled between a baseband module and a radio frequency (RF) module. The dispersion compensation module may be configured to process a data signal at an intermediate frequency that is between a baseband frequency and a RF frequency. Other embodiments may be described or claimed.

公开(公告)号：US20200304171A1

公开(公告)日：2020-09-24

申请号：US16897135

申请日：2020-06-09

Applicant: Intel Corporation

Inventor： Henning Braunisch ,  Georgios Dogiamis ,  Diego Correas-Serrano ,  Neelam Prabhu-Gaunkar ,  Telesphor Kamgaing ,  Cooper S. Levy ,  Chintan S. Thakkar ,  Stefano Pellerano

IPC: H04B3/32 ,  H04L25/03

Abstract: Embodiments may relate to a baseband module with communication pathways for a first data signal and a second data signal. The baseband module may also include a finite impulse response (FIR) filter in a communication path between the first signal input and the second signal output. Other embodiments may be described or claimed.