公开(公告)号：US20230411369A1

公开(公告)日：2023-12-21

申请号：US17841451

申请日：2022-06-15

Applicant: Intel Corporation

Inventor： Omkar G. Karhade ,  Kaveh Hosseini ,  Chia-Pin Chiu ,  Tim T. Hoang ,  Tolga Acikalin ,  Cooper S. Levy

IPC: H01L25/16 ,  G02B6/42 ,  H01L23/538 ,  H01L23/498 ,  H01L23/00

CPC classification number: H01L25/167 ,  G02B6/4274 ,  H01L23/5381 ,  H01L2224/16225 ,  H01L23/49811 ,  H01L24/16 ,  H01L23/5383

Abstract: In one embodiment, an integrated circuit package includes a package substrate with a cavity, an integrated circuit device, a bridge, a photonic integrated circuit (PIC), and an electronic integrated circuit (EIC). The integrated circuit device is electrically coupled to the package substrate. The bridge and the PIC are in the cavity of the package substrate, and the bridge is electrically coupled to the package substrate. The EIC is above, and electrically coupled to, the bridge and the PIC.

公开(公告)号：US12088360B2

公开(公告)日：2024-09-10

申请号：US16897135

申请日：2020-06-09

Applicant: Intel Corporation

Inventor： Henning Braunisch ,  Georgios Dogiamis ,  Diego Correas-Serrano ,  Neelam Prabhu Gaunkar ,  Telesphor Kamgaing ,  Cooper S. Levy ,  Chintan S. Thakkar ,  Stefano Pellerano

IPC: H04B3/32 ,  H04L25/03

CPC classification number: H04B3/32 ,  H04L25/03885

Abstract: Embodiments may relate to a baseband module with communication pathways for a first data signal and a second data signal. The baseband module may also include a finite impulse response (FIR) filter in a communication path between the first signal input and the second signal output. Other embodiments may be described or claimed.

公开(公告)号：US11664568B2

公开(公告)日：2023-05-30

申请号：US16437245

申请日：2019-06-11

Applicant: Intel Corporation

Inventor： Cooper S. Levy ,  Chintan S. Thakkar ,  James E. Jaussi ,  Bryan K. Casper

IPC: H01P3/123 ,  H04B1/40 ,  H01P3/16 ,  H01P3/12

CPC classification number: H01P3/123 ,  H01P3/122 ,  H01P3/16 ,  H04B1/40

Abstract: Embodiments disclosed herein include waveguides. In an embodiment, a waveguide comprises a conductive shell and a first ridge within the conductive shell. In an embodiment, the first ridge extends away from the conductive shell. In an embodiment, the waveguide further comprises a first core over the first ridge, where the first core comprises a first dielectric material with a first permittivity. In an embodiment, the waveguide may further comprise a second core embedded in the first core, where the second core comprises a second dielectric material with a second permittivity that is greater than the first permittivity.

公开(公告)号：US20200304171A1

公开(公告)日：2020-09-24

申请号：US16897135

申请日：2020-06-09

Applicant: Intel Corporation

Inventor： Henning Braunisch ,  Georgios Dogiamis ,  Diego Correas-Serrano ,  Neelam Prabhu-Gaunkar ,  Telesphor Kamgaing ,  Cooper S. Levy ,  Chintan S. Thakkar ,  Stefano Pellerano

IPC: H04B3/32 ,  H04L25/03

Abstract: Embodiments may relate to a baseband module with communication pathways for a first data signal and a second data signal. The baseband module may also include a finite impulse response (FIR) filter in a communication path between the first signal input and the second signal output. Other embodiments may be described or claimed.