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    TECHNIQUES FOR DEVICE-TO-DEVICE COMMUNICATIONS
    4.
    发明申请
    TECHNIQUES FOR DEVICE-TO-DEVICE COMMUNICATIONS 有权
    用于设备到设备通信的技术

    公开(公告)号：US20160285513A1

    公开(公告)日：2016-09-29

    申请号：US14668199

    申请日：2015-03-25

    Applicant: Intel Corporation

    Inventor： Shreyas Sen ,  Chintan S. Thakkar ,  Bryan K. Casper ,  James E. Jaussi

    IPC: H04B5/00 ,  H04W76/04 ,  H01P3/16

    CPC classification number: H04B5/0012 ,  H01P3/16 ,  H01Q13/24 ,  H04B5/0031

    Abstract: Embodiments of the present disclosure provide apparatuses and systems for proximity communications. The apparatus may include an integrated circuit (IC) package with a central processing unit (CPU) circuit, an input-output (I/O) circuit coupled with the CPU circuit, and a dielectric electromagnetic waveguide coupled with the I/O circuit, to enable communications between the CPU circuit and another apparatus. In another instance, the apparatus may include a plurality of coupler pads disposed on a first surface of the apparatus; and a processor electrically coupled with the coupler pads. One of the coupler pads may form capacitive coupling with one of coupler pads disposed on a second surface of another apparatus, in response to a placement of the first surface in at least partial contact with the second surface, to enable proximity data communication between the processor and the other apparatus. Other embodiments may be described and/or claimed.

    Abstract translation: 本公开的实施例提供用于邻近通信的装置和系统。 该装置可以包括具有中央处理单元（CPU）电路，与CPU电路耦合的输入输出（I / O）电路和与I / O电路耦合的介电电磁波导的集成电路（IC）封装， 以实现CPU电路和另一装置之间的通信。 在另一种情况下，该设备可以包括设置在设备的第一表面上的多个耦合器焊盘; 以及与耦合器焊盘电耦合的处理器。 响应于第一表面与第二表面至少部分接触的布置，耦合器中的一个可以与设置在另一装置的第二表面上的耦合器焊盘之一形成电容耦合，以使处理器之间的接近数据通信 和另一台设备。 可以描述和/或要求保护其他实施例。

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