公开(公告)号：US20240222249A1

公开(公告)日：2024-07-04

申请号：US18148355

申请日：2022-12-29

Applicant: Intel Corporation

Inventor： Jeremy D. Ecton ,  Srinivas V. Pietambaram ,  Gang Duan ,  Brandon Christian Marin ,  Suddhasattwa Nad ,  Oladeji T. Fadayomi ,  Manuel Gadogbe ,  Matthew L. Tingey

IPC: H01L23/498 ,  H01L21/48 ,  H01L23/15

CPC classification number: H01L23/49827 ,  H01L21/486 ,  H01L23/15 ,  H01L23/49822 ,  H01L24/16 ,  H01L2224/16227

Abstract: In one embodiment, an integrated circuit package substrate includes a glass layer having at least one roughened surface (e.g., with an average roughness above 100 nm) and a metal (e.g., a metal trace or metal via) in contact with the roughened surface of the glass layer.