公开(公告)号：US20230422389A1

公开(公告)日：2023-12-28

申请号：US18344308

申请日：2023-06-29

Applicant: Intel Corporation

Inventor： Prabhakar Subrahmanyam ,  Tejas J. Shah ,  Yi Xia ,  Ying-Feng Pang ,  Mark Lawrence Bianco ,  Vishnu Prasadh Sugumar ,  Vikas Kundapura Rao ,  Srinivasa Rao Damaraju ,  Ridvan Amir Sahan ,  Emad Shehadeh Al-Momani ,  Rahima Khatun Mohammed ,  Mirui Wang ,  Devdatta Prakash Kulkarni

IPC: H05K1/02 ,  H05K7/20

CPC classification number: H05K1/0203 ,  H05K7/20254 ,  H05K1/0271 ,  H05K2201/064

Abstract: Cold plates for secondary side components of printed circuit boards are disclosed herein. An example apparatus disclosed herein includes a first printed circuit board, a second printed circuit board coupled to the first printed circuit board, the second printed circuit board having a first side and a second side opposite the first side, the second side facing the first printed circuit board, and a cold plate coupled to the second side of the second printed circuit board.