-
公开(公告)号：US20230015619A1
公开(公告)日：2023-01-19
申请号：US17952080
申请日：2022-09-23
申请人： Intel Corporation
发明人： Kristof DARMAWAIKARTA , Robert MAY , Sashi KANDANUR , Sri Ranga Sai BOYAPATI , Srinivas PIETAMBARAM , Steve CHO , Jung Kyu HAN , Thomas HEATON , Ali LEHAF , Ravindranadh ELURI , Hiroki TANAKA , Aleksandar ALEKSOV , Dilan SENEVIRATNE
IPC分类号： H01L23/00 , H01L23/522 , H01L21/768
摘要： Embodiments described herein include electronic packages and methods of forming such packages. An electronic package includes a package substrate, first conductive pads formed over the package substrate, where the first conductive pads have a first surface area, and second conductive pads over the package substrate, where the second conductive pads have a second surface area greater than the first surface area. The electronic package also includes a solder resist layer over the first and second conductive pads, and a plurality of solder resist openings that expose one of the first or second conductive pads. The solder resist openings of the electronic package may include conductive material that is substantially coplanar with a top surface of the solder resist layer. The electronic package further includes solder bumps over the conductive material in the solder resist openings, where the solder bumps have a low bump thickness variation (BTV).
-
公开(公告)号：US20240177907A1
公开(公告)日：2024-05-30
申请号：US18059992
申请日：2022-11-30
申请人： Intel Corporation
发明人： Yosef KORNBLUTH , Whitney BRYKS , Ravindranadh ELURI , Aaditya Anand CANDADAI , Srinivas PIETAMBARAM
摘要： The present disclosure is directed to a carrier chuck having a base plate with a top surface, a plurality of first magnets positioned in a first region of the top surface, the plurality of first magnets configured to produce a first electromagnetic field to retain or suspend a panel placed on the carrier chuck during panel processing, wherein the first region corresponds to a region of the panel which comprises a magnetic material.
-
搜索结果
2 条记录 (耗时 0.011 秒)
