公开(公告)号：US20220352121A1

公开(公告)日：2022-11-03

申请号：US17858031

申请日：2022-07-05

Applicant: Intel Corporation

Inventor： Debendra MALLIK ,  Digvijay A. RAORANE ,  Ravindranath Vithal MAHAJAN ,  Mitul Bharat MODI

IPC: H01L25/065 ,  H01L21/768 ,  H01L21/822 ,  H01L23/31 ,  H01L23/42 ,  H01L23/48 ,  H01L23/00 ,  H01L21/56 ,  H01L25/00

Abstract: Semiconductor packages including passive support wafers, and methods of fabricating such semiconductor packages, are described. In an example, a semiconductor package includes a passive support wafer mounted on several active dies. The active dies may be attached to an active die wafer, and the passive support wafer may include a monolithic form to stabilize the active dies and active die wafer during processing and use. Furthermore, the passive support wafer may include a monolith of non-polymeric material to transfer and uniformly distribute heat generated by the active dies.

公开(公告)号：US20190287942A1

公开(公告)日：2019-09-19

申请号：US16349543

申请日：2016-12-29

Applicant: Intel Corporation

Inventor： Debendra MALLIK ,  Digvijay A. RAORANE ,  Ravindranath Vithal MAHAJAN ,  Mitul Bharat MODI

IPC: H01L25/065 ,  H01L23/00 ,  H01L23/31 ,  H01L23/42 ,  H01L23/48 ,  H01L21/768 ,  H01L21/822

Abstract: Semiconductor packages including passive support wafers, and methods of fabricating such semiconductor packages, are described. In an example, a semiconductor package includes a passive support wafer mounted on several active dies. The active dies may be attached to an active die wafer, and the passive support wafer may include a monolithic form to stabilize the active dies and active die wafer during processing and use. Furthermore, the passive support wafer may include a monolith of non-polymeric material to transfer and uniformly distribute heat generated by the active dies.