公开(公告)号：US20220004468A1

公开(公告)日：2022-01-06

申请号：US17479267

申请日：2021-09-20

Applicant: Intel Corporation

Inventor： Thomas Willhalm ,  Francesc Guim Bernat ,  Karthik Kumar ,  Rita Gupta ,  Mark Schmisseur ,  Dimitrios Ziakas

IPC: G06F11/20 ,  G06F11/14 ,  G06F9/50 ,  G06F9/445 ,  G06F12/14

Abstract: An embodiment of an electronic apparatus may comprise one or more substrates, and a controller coupled to the one or more substrates, the controller to allocate a first secure portion of a pooled memory to a first instantiation of an application on a first node, and circuitry coupled to the one or more substrates and the controller, the circuitry to provide a failover interface for a second instantiation of the application on a second node to access the first secure portion of the pooled memory in the event of a failure of the first node. Other embodiments are disclosed and claimed.