公开(公告)号：US11115025B2

公开(公告)日：2021-09-07

申请号：US15940864

申请日：2018-03-29

Applicant: Intel Corporation

Inventor： Sergey Y. Shumarayev ,  David W. Mendel ,  Joel Martinez ,  Curt Wortman

IPC: H03K19/17736 ,  G06F13/42 ,  H04L7/033 ,  H01Q21/00 ,  H04L12/40

Abstract: The present disclosure relates to modular transceiver-based network circuitries that may include internal configurable interfaces or gaskets. The configurable gaskets may facilitate integration of the network circuitries in electronic devices by providing a transparent interface to processing circuitries coupled to the network circuitries. Moreover, the configurable gaskets may also have a floorplan layout (e.g., a chiplet layout) that may facilitate coupling of multiple network circuitries to a single processing circuitry, in a modular manner.

公开(公告)号：US20190044517A1

公开(公告)日：2019-02-07

申请号：US15940864

申请日：2018-03-29

Applicant: Intel Corporation

Inventor： Sergey Y. Shumarayev ,  David W. Mendel ,  Joel Martinez ,  Curt Wortman

IPC: H03K19/177 ,  H04L7/033 ,  G06F13/42

Abstract: The present disclosure relates to modular transceiver-based network circuitries that may include internal configurable interfaces or gaskets. The configurable gaskets may facilitate integration of the network circuitries in electronic devices by providing a transparent interface to processing circuitries coupled to the network circuitries. Moreover, the configurable gaskets may also have a floorplan layout (e.g., a chiplet layout) that may facilitate coupling of multiple network circuitries to a single processing circuitry, in a modular manner.