公开(公告)号：US20220113774A1

公开(公告)日：2022-04-14

申请号：US17556703

申请日：2021-12-20

Applicant: Intel Corporation

Inventor： Shahin AMIRI ,  Mirui WANG ,  Evan PANG ,  Robert SCHUM ,  Shahed SAFAVI-BAYAT ,  Xuefeng MA ,  Jason LEE PACK ,  Yvan LARGE

IPC: G06F1/20 ,  G06F13/42

Abstract: An apparatus is described. The apparatus includes an add-in card having a power connector to receive power other than through the add-in card's host connector. The power connector fitted in a notch of a printed circuit board of the add-in card so that, when the printed circuit board is oriented to have an upper surface with semiconductor chips disposed thereon, an upper surface of the connector is above the upper surface of the printed circuit board and a lower surface of the connector is below a lower surface of the printed circuit board.