公开(公告)号：US20220093536A1

公开(公告)日：2022-03-24

申请号：US17030121

申请日：2020-09-23

Applicant: Intel Corporation

Inventor： Krishna BHARATH ,  William J. LAMBERT ,  Haifa HARIRI ,  Siddharth KULASEKARAN ,  Mathew MANUSHAROW ,  Anne AUGUSTINE

IPC: H01L23/64 ,  H01L23/00 ,  H01L23/498 ,  H01L23/552 ,  H01L21/48

Abstract: Embodiments disclosed herein include coreless interposers with embedded inductors. In an embodiment, a coreless interposer comprises a plurality of buildup layers, where electrical routing is provided in the plurality of buildup layers. In an embodiment, the coreless interposer further comprises an inductor embedded in the plurality of buildup layers. In an embodiment, the inductor comprises a magnetic shell, and a conductive lining over an interior surface of the magnetic shell.

公开(公告)号：US20200006287A1

公开(公告)日：2020-01-02

申请号：US16025710

申请日：2018-07-02

Applicant: Intel Corporation

Inventor： Michael J. HILL ,  Leigh E. WOJEWODA ,  Mathew MANUSHAROW ,  Siddharth KULASEKARAN

IPC: H01L25/065 ,  H01L49/02 ,  H01L23/64 ,  H01L23/34 ,  H01F27/08

Abstract: Embodiments include a microelectronic device package structure having an inductor within a portion of a substrate, wherein the inductor is at least partially embedded within the substrate. One or more thermal vent structures extend through at least one of the substrate or a board attached to the substrate. The one or more thermal vent structures provide a thermal pathway for cooling for the inductor.