公开(公告)号：US20180323172A1

公开(公告)日：2018-11-08

申请号：US15772478

申请日：2015-12-22

Applicant: Intel Corporation

Inventor： Mao GUO ,  Sireesha GOGINENI

IPC: H01L25/065 ,  H01L25/00 ,  H01L23/13 ,  H01L23/00

CPC classification number: H01L25/0657 ,  H01L21/48 ,  H01L23/13 ,  H01L24/48 ,  H01L25/50 ,  H01L2224/32145 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2224/73265 ,  H01L2225/0651 ,  H01L2225/06562 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2224/45099

Abstract: A package with improved solder joint reliability is disclosed. The package includes dummy beams with less rigidity and stiffness (relative to the die) that are placed in between the die and the substrate. The reduced rigidity and stiffness of the dummy beams significantly mitigates any die shadow effects on the solder joints. Also, because the die is attached to the dummy beams and does not directly contact the substrate itself, the die shadow effect from a rigid die is further reduced.