公开(公告)号：US20240172356A1

公开(公告)日：2024-05-23

申请号：US18056267

申请日：2022-11-17

Applicant: Intel Corporation

Inventor： Tejasweeni D LINGAYAT ,  Maruti TAMRAKAR ,  Sudarshan SOLANKI ,  Bala SUBRAMANYA ,  Yagnesh Vinodrai WAGHELA

IPC: H05K1/02 ,  H05K1/11

CPC classification number: H05K1/023 ,  H05K1/0218 ,  H05K1/115

Abstract: A printed circuit board includes a ground plane, a power plane having a first main surface and a second main surface opposite to the first main surface, wherein the second main surface faces the ground plane and a shielding structure partially covering the power plane. The shielding structure includes a metal structure covering a peripheral area of the first main surface from a direction facing the first main surface and a plurality of vias electrically and mechanically coupling the metal structure to the ground plane.