公开(公告)号：US20210235603A1

公开(公告)日：2021-07-29

申请号：US17186092

申请日：2021-02-26

Applicant: Intel Corporation

Inventor： Justin HUTTULA ,  Bala SUBRAMANYA ,  Juha PAAVOLA ,  Mark CARBONE ,  Todd SMITH ,  Kari MANSUKOSKI ,  Samarth ALVA ,  Satyajit Siddharay KAMAT ,  Nagaraj K

IPC: H05K9/00 ,  H05K7/20

Abstract: A circuit board and vapor chamber are disclosed. Connectors couple the vapor chamber to a circuit board. The connectors extend from the bottom of the vapor chamber. The connectors fix the vapor chamber to the circuit board such that the bottom of the vapor chamber thermally couples to a heat source on the circuit board. The circuit board has a connector assembly that couples to the vapor chamber.

公开(公告)号：US20250046983A1

公开(公告)日：2025-02-06

申请号：US18361952

申请日：2023-07-31

Applicant: Intel Corporation

Inventor： Bala SUBRAMANYA ,  Prakash KURMA RAJU ,  Jayprakash THAKUR ,  Zaman Zaid MULLA ,  Praveen KUMAR ,  Yagnesh Vinodrai WAGHELA ,  Maruti TAMRAKAR ,  Prasanna PICHUMANI ,  Harry SKINNER

IPC: H01Q1/22 ,  H01Q1/40 ,  H01Q1/48 ,  H01Q1/52

Abstract: Disclosed herein is an encapsulated antenna for reducing the impact of radio frequency interference (RFI) that may couple to the antenna at frequencies within the Wi-FI 5/6e bandwidths. The encapsulated antenna device may include an insulating housing and a metal layer arranged within a cavity of the housing. The encapsulated antenna device also includes an antenna device comprising a ground terminal and an antenna body, wherein the ground terminal is connected to the metal layer, wherein the antenna body is arranged above the metal layer and within the cavity. The encapsulated antenna device also includes a spacer between the metal layer and the antenna body that provides an offset distance between the metal layer and the antenna body.

公开(公告)号：US20240172356A1

公开(公告)日：2024-05-23

申请号：US18056267

申请日：2022-11-17

Applicant: Intel Corporation

Inventor： Tejasweeni D LINGAYAT ,  Maruti TAMRAKAR ,  Sudarshan SOLANKI ,  Bala SUBRAMANYA ,  Yagnesh Vinodrai WAGHELA

IPC: H05K1/02 ,  H05K1/11

CPC classification number: H05K1/023 ,  H05K1/0218 ,  H05K1/115

Abstract: A printed circuit board includes a ground plane, a power plane having a first main surface and a second main surface opposite to the first main surface, wherein the second main surface faces the ground plane and a shielding structure partially covering the power plane. The shielding structure includes a metal structure covering a peripheral area of the first main surface from a direction facing the first main surface and a plurality of vias electrically and mechanically coupling the metal structure to the ground plane.