公开(公告)号：US20170221793A1

公开(公告)日：2017-08-03

申请号：US15197129

申请日：2016-06-29

Applicant: Intel Corporation

Inventor： Jeffory L. SMALLEY ,  Susan F. SMITH ,  Thu HUYNH ,  Mani PRAKASH

IPC: H01L23/427 ,  H01L25/00 ,  H01L25/065 ,  H05K7/20 ,  H05K1/02

CPC classification number: H01L23/427 ,  H01L23/3672 ,  H01L23/473 ,  H01L25/0655 ,  H01L25/50 ,  H05K1/0203 ,  H05K7/20336 ,  H05K7/20409 ,  H05K7/20509 ,  H05K2201/10522

Abstract: An apparatus including a primary device and at least one secondary device coupled to a substrate; a heat exchanger disposed on the primary device and on the at least one secondary device, wherein the heat exchanger includes at least one portion disposed over an area corresponding to the primary device or the at least one second device including a deflectable surface; and at least one thermally conductive conduit coupled to the heat exchanger. A method including placing a heat exchanger on a multi-chip package, the heat exchanger including the heat exchanger including at least one floating section operable to move in a direction toward or away from at least one of the plurality of dice and at least one thermally conductive conduit disposed in a channel of the heat exchanger and connected to the at least one floating section; and coupling the heat exchanger to the multi-chip package.