公开(公告)号：US20210235603A1

公开(公告)日：2021-07-29

申请号：US17186092

申请日：2021-02-26

Applicant: Intel Corporation

Inventor： Justin HUTTULA ,  Bala SUBRAMANYA ,  Juha PAAVOLA ,  Mark CARBONE ,  Todd SMITH ,  Kari MANSUKOSKI ,  Samarth ALVA ,  Satyajit Siddharay KAMAT ,  Nagaraj K

IPC: H05K9/00 ,  H05K7/20

Abstract: A circuit board and vapor chamber are disclosed. Connectors couple the vapor chamber to a circuit board. The connectors extend from the bottom of the vapor chamber. The connectors fix the vapor chamber to the circuit board such that the bottom of the vapor chamber thermally couples to a heat source on the circuit board. The circuit board has a connector assembly that couples to the vapor chamber.