公开(公告)号：US20230420378A1

公开(公告)日：2023-12-28

申请号：US17847407

申请日：2022-06-23

Applicant: Intel Corporation

Inventor： Sameer Paital ,  Gang Duan ,  Srinivas V. Pietambaram ,  Kristof Kuwawi Darmawikarta ,  Tchefor Ndukum ,  Vejayakumaran Padavettan ,  Pooja Wadhwa ,  Brandon C. Marin

IPC: H01L23/538 ,  H01L25/065 ,  H01L21/48 ,  H01L23/00

CPC classification number: H01L23/5386 ,  H01L25/0655 ,  H01L23/5383 ,  H01L23/5381 ,  H01L21/4857 ,  H01L24/16 ,  H01L2224/16227

Abstract: Embodiments of a microelectronic assembly comprise an interposer comprising a dielectric material and a pad of conductive material having at least one of a ceramic liner and fin structures; at least two integrated circuit (IC) dies coupled to the interposer; and a bridge die in the interposer conductively coupled to the at least two IC dies. The bridge die has a first face and an opposing second face, the first face of the bridge die is proximate to the at least two IC dies, and the second face of the bridge die is in contact with the pad.