公开(公告)号：US20240112970A1

公开(公告)日：2024-04-04

申请号：US17957355

申请日：2022-09-30

Applicant: Intel Corporation

Inventor： Hanyu Song ,  Vinith Bejugam ,  Yonggang Li ,  Gang Duan ,  Aaron Garelick

IPC: H01L23/15 ,  H01L21/48 ,  H01L23/13 ,  H01L23/498

CPC classification number: H01L23/15 ,  H01L21/481 ,  H01L21/4857 ,  H01L23/13 ,  H01L23/49822 ,  H01L24/73 ,  H01L2224/73204

Abstract: An integrated circuit (IC) device comprises a substrate comprising a glass core. The glass core includes a first surface, a second surface opposite the first surface, a sidewall between the first surface and the second surface, and a corner region where the first sidewall meets the first surface. A first build-up layer is on at least the first surface. In some embodiments, the corner region comprises a recess and a dielectric material within the recess. In other embodiments, the corner region comprises a first compressive stress and the glass core comprises a second region. The second region comprises a second compressive stress. The first compressive stress is greater than the second compressive stress.