公开(公告)号：US20170186667A1

公开(公告)日：2017-06-29

申请号：US14757997

申请日：2015-12-26

Applicant: Intel Corporation

Inventor： Arnab Choudhury ,  Patrick Nardi ,  William Nicholas Labanok ,  Kelly P. Lofgreen

IPC: H01L23/473 ,  H01L23/00 ,  H01L21/48 ,  H01L23/053 ,  G06F1/20 ,  H01L23/367

CPC classification number: H01L23/473 ,  G06F1/20 ,  G06F2200/201 ,  H01L21/4878 ,  H01L21/4882 ,  H01L23/053 ,  H01L23/3672 ,  H01L24/32 ,  H01L2224/32245

Abstract: Embodiments are generally directed to cooling of electronics using folded foil microchannels. An embodiment of an apparatus includes a semiconductor die; a substrate, the semiconductor die being coupled with the substrate; and a cooling apparatus for the semiconductor die, wherein the cooling apparatus includes a folded foil preform, the folded foil forming a plurality of microchannels, and a fluid coolant system to direct a fluid coolant through the microchannels of the folded foil.