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公开(公告)号：US20160279862A1
公开(公告)日：2016-09-29
申请号：US14671760
申请日：2015-03-27
Applicant: Intel Corporation
Inventor： Denica N. Larsen , Wing K. Ho
CPC classification number: B26F3/12 , B29L2031/34 , G06F1/1626 , Y10S156/924 , Y10S156/937 , Y10T156/1153 , Y10T156/1911
Abstract: Methods and apparatus relating to provision and/or utilization of a hidden feature for accessing and/or repairing mobile devices are described. An embodiment includes a wire physically adjacent to an adhesive. The adhesive bonds a first portion of a computing device and a second portion of the computing device. The wire is capable of being heated in response to application of electrical voltage or current. In turn, the heated wire causes cutting of the adhesive to allow for physical separation of the first portion of the computing device and the second portion of the computing device. Another embodiment utilizes a hidden end of an opening in a computing device to hide a fastener. Other embodiments are also disclosed and claimed.
Abstract translation: 描述了提供和/或利用用于访问和/或修复移动设备的隐藏特征的方法和设备。 实施例包括物理上与粘合剂相邻的导线。 粘合剂结合计算设备的第一部分和计算设备的第二部分。 导线能够响应于电压或电流的应用而被加热。 反过来，加热的线导致粘合剂的切割，以允许计算设备的第一部分和计算设备的第二部分的物理分离。 另一实施例利用计算设备中的开口的隐藏端来隐藏紧固件。 还公开并要求保护其他实施例。
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公开(公告)号：US20180154544A1
公开(公告)日：2018-06-07
申请号：US15866411
申请日：2018-01-09
Applicant: Intel Corporation
Inventor： Denica N. Larsen , Wing K. Ho
CPC classification number: B26F3/12 , B29L2031/34 , G06F1/1626 , G06F1/1656 , Y10S156/924 , Y10S156/937 , Y10T156/1153 , Y10T156/1911
Abstract: Methods and apparatus relating to provision and/or utilization of a hidden feature for accessing and/or repairing mobile devices are described. An embodiment includes a wire physically adjacent to an adhesive. The adhesive bonds a first portion of a computing device and a second portion of the computing device. The wire is capable of being heated in response to application of electrical voltage or current. In turn, the heated wire causes cutting of the adhesive to allow for physical separation of the first portion of the computing device and the second portion of the computing device. Another embodiment utilizes a hidden end of an opening in a computing device to hide a fastener. Other embodiments are also disclosed and claimed.
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公开(公告)号：US09862115B2
公开(公告)日：2018-01-09
申请号：US14671760
申请日：2015-03-27
Applicant: Intel Corporation
Inventor： Denica N. Larsen , Wing K. Ho
CPC classification number: B26F3/12 , B29L2031/34 , G06F1/1626 , Y10S156/924 , Y10S156/937 , Y10T156/1153 , Y10T156/1911
Abstract: Methods and apparatus relating to provision and/or utilization of a hidden feature for accessing and/or repairing mobile devices are described. An embodiment includes a wire physically adjacent to an adhesive. The adhesive bonds a first portion of a computing device and a second portion of the computing device. The wire is capable of being heated in response to application of electrical voltage or current. In turn, the heated wire causes cutting of the adhesive to allow for physical separation of the first portion of the computing device and the second portion of the computing device. Another embodiment utilizes a hidden end of an opening in a computing device to hide a fastener. Other embodiments are also disclosed and claimed.
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