公开(公告)号：US20250006646A1

公开(公告)日：2025-01-02

申请号：US18216525

申请日：2023-06-29

Applicant: Intel Corporation

Inventor： Xing Sun ,  Srinivas Pietambaram ,  Darko Grujicic ,  Rengarajan Shanmugam ,  Brian Balch ,  Micah Armstrong ,  Qiang Li ,  Marcel Wall ,  Rahul Manepalli

IPC: H01L23/538 ,  H01L21/48 ,  H01L23/00 ,  H01L23/15 ,  H01L25/065

Abstract: Integrated circuit (IC) die packages including a glass with conductive through-glass vias (TGVs). The TGVs are lined with a buffer comprising an inorganic material having a low elastic (Young's) modulus. The buffer may thereby accommodate internal stress between the glass and through via metallization formed over the buffer. The compliant inorganic material may be a metal or metal alloy, for example, different than that of the via metallization. The inorganic material may also be a metal nitride, metal silicide, or metal carbide. A TGV buffer may be one material layer of a stack comprising two or more material layers deposited upon TGV sidewall surfaces. A routing structure may be built-up on at least one side of the glass and IC die assembled to the routing structure. The buffer Ipresent within the TGVs may be absent from metal features of the routing structure.

公开(公告)号：US20230402368A1

公开(公告)日：2023-12-14

申请号：US17837732

申请日：2022-06-10

Applicant: Intel Corporation

Inventor： Benjamin T. Duong ,  Brian P. Balch ,  Kristof Darmawikarta ,  Darko Grujicic ,  Suddhasattwa Nad ,  Xing Sun ,  Marcel A. Wall ,  Yi Yang

IPC: H01L23/522 ,  H01C7/00 ,  H01L49/02

CPC classification number: H01L23/5228 ,  H01L28/24 ,  H01L23/5226 ,  H01C7/006

Abstract: Techniques for thin-film resistors in vias are disclosed. In the illustrative embodiment, thin-film resistors are formed in through-glass vias of a glass substrate of an interposer. The thin-film resistors do not take up a significant amount of area on a layer of the interposer, as the thin-film resistor extends vertically through a via rather than horizontally on a layer of the interposer. The thin-film resistors may be used for any suitable purpose, such as power dissipation or voltage control, current control, as a pull-up or pull-down resistor, etc.