公开(公告)号：US20220013505A1

公开(公告)日：2022-01-13

申请号：US17485078

申请日：2021-09-24

Applicant: Intel Corporation

Inventor： Saravanan Sethuraman ,  Tonia Morris ,  Siaw Kang Lai ,  Yee Choong Lim ,  Yu Ying Ong

IPC: H01L25/065 ,  G11C5/02 ,  G06F12/10

Abstract: An integrated circuit may include circuitry for accessing an associated die stack. The circuitry may receive temperature information as well as a plurality of operating parameters that help determine whether it may be desirable to reroute access commands or requests to one or more die in the stack. The circuitry may include a smart crossbar switch that implements an address translation or hashing function to help map the logical user address to a physical address space. Performing thermally aware traffic management in this way can ensure that acceptable timing margins are maintained in the system to minimize the probability of errors.

公开(公告)号：US11658159B2

公开(公告)日：2023-05-23

申请号：US17485078

申请日：2021-09-24

Applicant: Intel Corporation

Inventor： Saravanan Sethuraman ,  Tonia Morris ,  Siaw Kang Lai ,  Yee Choong Lim ,  Yu Ying Ong

IPC: G11C11/00 ,  H01L25/065 ,  G11C5/02 ,  G06F12/10

CPC classification number: H01L25/0657 ,  G06F12/10 ,  G11C5/025 ,  G06F2212/657 ,  H01L2225/06541 ,  H01L2225/06589

Abstract: An integrated circuit may include circuitry for accessing an associated die stack. The circuitry may receive temperature information as well as a plurality of operating parameters that help determine whether it may be desirable to reroute access commands or requests to one or more die in the stack. The circuitry may include a smart crossbar switch that implements an address translation or hashing function to help map the logical user address to a physical address space. Performing thermally aware traffic management in this way can ensure that acceptable timing margins are maintained in the system to minimize the probability of errors.

公开(公告)号：US11164847B2

公开(公告)日：2021-11-02

申请号：US16701739

申请日：2019-12-03

Applicant: Intel Corporation

Inventor： Saravanan Sethuraman ,  Tonia Morris ,  Siaw Kang Lai ,  Yee Choong Lim ,  Yu Ying Ong

IPC: G11C16/04 ,  H01L25/065 ,  G11C5/02 ,  G06F12/10

Abstract: An integrated circuit may include circuitry for accessing an associated die stack. The circuitry may receive temperature information as well as a plurality of operating parameters that help determine whether it may be desirable to reroute access commands or requests to one or more die in the stack. The circuitry may include a smart crossbar switch that implements an address translation or hashing function to help map the logical user address to a physical address space. Performing thermally aware traffic management in this way can ensure that acceptable timing margins are maintained in the system to minimize the probability of errors.