公开(公告)号：US20230094707A1

公开(公告)日：2023-03-30

申请号：US17485999

申请日：2021-09-27

申请人： International Business Machines Corporation

发明人： Richard C. Johnson ,  Alex Richard Hubbard ,  Vinay Pai ,  Cody J. Murray ,  Fee Li Lie ,  Nikhil Jain

IPC分类号： G06F21/73

摘要： Embodiments are disclosed for a method. The method includes generating a correction datastore indicating shifts in magnitude representing corresponding characters that uniquely identify hardware comprising a computer processing chip. The method further includes generating security masks based on a correction file. Additionally, the method includes using a correction process for the computer processing chip. The generated security masks include corresponding overlays representing the shifts in magnitude with respect to corresponding product masks for the computer processing chip. The method also includes generating the computer processing chip using the security masks and the product masks.

公开(公告)号：US11569134B2

公开(公告)日：2023-01-31

申请号：US16847811

申请日：2020-04-14

申请人： International Business Machines Corporation

发明人： Nikhil Jain ,  Hsueh-Chung Chen ,  Mary Claire Silvestre ,  Hosadurga Shobha

IPC分类号： H01L21/66 ,  G01N21/956 ,  G01B11/30 ,  G01N21/95 ,  G01B11/16 ,  H01L21/67 ,  G03F7/20 ,  G01B11/255

摘要： A semiconductor structure and a method for managing semiconductor wafer stress are disclosed. The semiconductor structure includes a semiconductor wafer, a first stress layer disposed on and in contact with a backside of the semiconductor wafer, and a second stress layer on and in contact with the first stress layer. The first stress layer exerts a first stress on the semiconductor wafer and the second layer exerts a second stress on the semiconductor wafer that is opposite the first backside stress. The method includes forming a first stress layer on and in contact with a backside of a semiconductor wafer, and further forming a second stress layer on and in contact with the first stress layer. The first stress layer exerts a first stress on the semiconductor wafer and the second stress layer exerts a second stress on the semiconductor wafer that is opposite to the first stress.

公开(公告)号：US20220415523A1

公开(公告)日：2022-12-29

申请号：US17356796

申请日：2021-06-24

申请人： International Business Machines Corporation

发明人： Richard C. Johnson ,  Alex Richard Hubbard ,  Cody J. Murray ,  Vinay Pai ,  Nikhil Jain

IPC分类号： G16H50/80 ,  G06Q20/20

摘要： In an approach, a processor receives device identification information corresponding to at least one device local to a location of a transaction. A processor receives notification of an infected user. A processor determines that the infected user is associated with the transaction. A processor identifies a second user from the device identification information. A processor sends a notification to the second user.