公开(公告)号：US20240087939A1

公开(公告)日：2024-03-14

申请号：US17932050

申请日：2022-09-14

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor： VINAY PAI ,  Nikhil Jain ,  Alex Richard Hubbard ,  Cody J. Murray ,  Richard C. Johnson

IPC: H01L21/683 ,  H01L21/67

CPC classification number: H01L21/6833 ,  H01L21/67092 ,  H01L21/67288 ,  H01L21/6838

Abstract: Described is a semiconductor processing system including a measurement tool configured to measure warpage characteristics in a semiconductor wafer. The semiconductor processing system further includes a pixelated surface configured to retain the semiconductor wafer, where the pixelated surface approximates the warpage characteristics to conform to the semiconductor wafer. The semiconductor processing system further includes a semiconductor processing tool configured to perform processing on the semiconductor wafer while it is retained on the pixelated surface.

公开(公告)号：US20220415523A1

公开(公告)日：2022-12-29

申请号：US17356796

申请日：2021-06-24

Applicant: International Business Machines Corporation

Inventor： Richard C. Johnson ,  Alex Richard Hubbard ,  Cody J. Murray ,  Vinay Pai ,  Nikhil Jain

IPC: G16H50/80 ,  G06Q20/20

Abstract: In an approach, a processor receives device identification information corresponding to at least one device local to a location of a transaction. A processor receives notification of an infected user. A processor determines that the infected user is associated with the transaction. A processor identifies a second user from the device identification information. A processor sends a notification to the second user.

公开(公告)号：US20220406657A1

公开(公告)日：2022-12-22

申请号：US17351307

申请日：2021-06-18

Applicant: International Business Machines Corporation

Inventor： SOMNATH GHOSH ,  Karen Elizabeth Petrillo ,  Cody J. Murray ,  Ekmini Anuja De Silva ,  Chi-Chun LIU ,  Dominik METZLER ,  John Christopher Arnold

IPC: H01L21/768 ,  H01L21/3213

Abstract: A method of manufacturing a semiconductor device is provided. The method includes forming a plurality of metal lines on substrate, forming a sacrificial dielectric material layer between the metal lines, forming a hardmask over at least one of the metal lines, etching at least one of the metal lines that is not covered by the hardmask, treating the sacrificial dielectric material layer to soften the layer. The method also includes removing the treated sacrificial dielectric material layer.

公开(公告)号：US11688636B2

公开(公告)日：2023-06-27

申请号：US17351307

申请日：2021-06-18

Applicant: International Business Machines Corporation

Inventor： Somnath Ghosh ,  Karen Elizabeth Petrillo ,  Cody J. Murray ,  Ekmini Anuja De Silva ,  Chi-Chun Liu ,  Dominik Metzler ,  John Christopher Arnold

IPC: H01L21/768 ,  H01L21/3213 ,  H01L23/532

CPC classification number: H01L21/76892 ,  H01L21/32135 ,  H01L21/32139 ,  H01L21/76837 ,  H01L23/53242

Abstract: A method of manufacturing a semiconductor device is provided. The method includes forming a plurality of metal lines on substrate, forming a sacrificial dielectric material layer between the metal lines, forming a hardmask over at least one of the metal lines, etching at least one of the metal lines that is not covered by the hardmask, treating the sacrificial dielectric material layer to soften the layer. The method also includes removing the treated sacrificial dielectric material layer.

公开(公告)号：US20230094707A1

公开(公告)日：2023-03-30

申请号：US17485999

申请日：2021-09-27

Applicant: International Business Machines Corporation

Inventor： Richard C. Johnson ,  Alex Richard Hubbard ,  Vinay Pai ,  Cody J. Murray ,  Fee Li Lie ,  Nikhil Jain

IPC: G06F21/73

Abstract: Embodiments are disclosed for a method. The method includes generating a correction datastore indicating shifts in magnitude representing corresponding characters that uniquely identify hardware comprising a computer processing chip. The method further includes generating security masks based on a correction file. Additionally, the method includes using a correction process for the computer processing chip. The generated security masks include corresponding overlays representing the shifts in magnitude with respect to corresponding product masks for the computer processing chip. The method also includes generating the computer processing chip using the security masks and the product masks.

公开(公告)号：US12254992B2

公开(公告)日：2025-03-18

申请号：US17356796

申请日：2021-06-24

Applicant: International Business Machines Corporation

Inventor： Richard C. Johnson ,  Alex Richard Hubbard ,  Cody J. Murray ,  Vinay Pai ,  Nikhil Jain

IPC: G16H50/80 ,  G06Q20/20

Abstract: In an approach, a processor receives device identification information corresponding to at least one device local to a location of a transaction. A processor receives notification of an infected user. A processor determines that the infected user is associated with the transaction. A processor identifies a second user from the device identification information. A processor sends a notification to the second user.

公开(公告)号：US11947712B2

公开(公告)日：2024-04-02

申请号：US17485999

申请日：2021-09-27

Applicant: International Business Machines Corporation

Inventor： Richard C. Johnson ,  Alex Richard Hubbard ,  Vinay Pai ,  Cody J. Murray ,  Fee Li Lie ,  Nikhil Jain

IPC: H04L29/00 ,  G06F21/73

CPC classification number: G06F21/73

Abstract: Embodiments are disclosed for a method. The method includes generating a correction datastore indicating shifts in magnitude representing corresponding characters that uniquely identify hardware comprising a computer processing chip. The method further includes generating security masks based on a correction file. Additionally, the method includes using a correction process for the computer processing chip. The generated security masks include corresponding overlays representing the shifts in magnitude with respect to corresponding product masks for the computer processing chip. The method also includes generating the computer processing chip using the security masks and the product masks.

公开(公告)号：US11561481B2

公开(公告)日：2023-01-24

申请号：US16932983

申请日：2020-07-20

Applicant: International Business Machines Corporation

Inventor： Cody J. Murray ,  Ekmini Anuja De Silva ,  Christopher Frederick Robinson ,  Luciana Meli

IPC: G03F7/20 ,  G03F7/38 ,  G06T7/00

Abstract: Techniques for using open frame (E0) exposures for lithographic tool track/cluster monitoring are provided. In one aspect, a method for monitoring a lithographic process includes: performing open frame exposures E0 of at least one wafer coated with a photoresist using a photolithography tool; baking and developing the at least one wafer; performing a defect inspection of the at least one wafer to generate a haze map; grouping haze data from the haze map; and analyzing the haze data to identify a maximum E0 response dose E′.

公开(公告)号：US20220019139A1

公开(公告)日：2022-01-20

申请号：US16932983

申请日：2020-07-20

Applicant: International Business Machines Corporation

Inventor： Cody J. Murray ,  Ekmini Anuja De Silva ,  Christopher Frederick Robinson ,  Luciana Meli

IPC: G03F1/70 ,  G03F7/20 ,  G03F1/84 ,  G03F7/38 ,  G06T7/00

Abstract: Techniques for using open frame (E0) exposures for lithographic tool track/cluster monitoring are provided. In one aspect, a method for monitoring a lithographic process includes: performing open frame exposures E0 of at least one wafer coated with a photoresist using a photolithography tool; baking and developing the at least one wafer; performing a defect inspection of the at least one wafer to generate a haze map; grouping haze data from the haze map; and analyzing the haze data to identify a maximum E0 response dose E′.