INLINE VACUUM PROCESSING SYSTEM WITH SUBSTRATE AND CARRIER COOLING

    公开(公告)号:US20200350188A1

    公开(公告)日:2020-11-05

    申请号:US15929378

    申请日:2020-04-29

    申请人: INTEVAC, INC.

    摘要: A substrate processing system, including a processing module having at least one sputtering source; a first buffer module positioned on a first side of the processing module; a second buffer module positioned on a second side of the processing module directly opposite the first side; a first cooling module attached to the first buffer module; a second cooling module attached to the second buffer module; a transport system transporting substrate carriers in a straight line through the first cooling module, the first buffer module, the processing module, the second buffer module and the second cooling module; wherein the system is arranged linearly in the order: first cooling module, the first buffer module, the processing module, the second buffer module and the second cooling module.

    MULTI-COLORED DIELECTRIC COATING AND UV INKJET PRINTING

    公开(公告)号:US20190383977A1

    公开(公告)日:2019-12-19

    申请号:US16442133

    申请日:2019-06-14

    申请人: Intevac, Inc.

    摘要: A multi-color dielectric coating is formed using interleaved layers of dielectric material, having alternating refractive index, to create reflections at selected wavelengths, thus appearing as different colors. Etching of selected layers at selected locations changes the color appearance of the etched locations, thus generating a coating having multiple colors. The thicknesses of the layers are chosen such that the path-length differences for reflections from different high-index layers are integer multiples of the wavelength for which the coating is designed. Inkjet printer is used to print a design and the design is cured using UV radiation.