公开(公告)号：US20170103968A1

公开(公告)日：2017-04-13

申请号：US14993586

申请日：2016-01-12

Applicant: Invensas Corporation

Inventor： Ashok S. PRABHU ,  Abiola AWUJOOLA ,  Wael ZOHNI ,  Willmar SUBIDO

IPC: H01L25/065 ,  H01L23/31

Abstract: Apparatuses relating generally to a vertically integrated microelectronic package are disclosed. In an apparatus thereof, a substrate has an upper surface and a lower surface opposite the upper surface. A first microelectronic device is coupled to the upper surface of the substrate. The first microelectronic device is a passive microelectronic device. First wire bond wires are coupled to and extend away from the upper surface of the substrate. Second wire bond wires are coupled to and extend away from an upper surface of the first microelectronic device. The second wire bond wires are shorter than the first wire bond wires. A second microelectronic device is coupled to upper ends of the first wire bond wires and the second wire bond wires. The second microelectronic device is located above the first microelectronic device and at least partially overlaps the first microelectronic device.

公开(公告)号：US20160329294A1

公开(公告)日：2016-11-10

申请号：US14796745

申请日：2015-07-10

Applicant: Invensas Corporation

Inventor： Willmar SUBIDO ,  Reynaldo CO ,  Wael ZOHNI ,  Ashok S. PRABHU

IPC: H01L23/00 ,  H01L23/498

CPC classification number: H01L24/48 ,  H01L24/45 ,  H01L24/81 ,  H01L24/85 ,  H01L2224/05124 ,  H01L2224/05147 ,  H01L2224/05155 ,  H01L2224/05624 ,  H01L2224/05647 ,  H01L2224/05655 ,  H01L2224/05664 ,  H01L2224/05666 ,  H01L2224/45147 ,  H01L2224/45565 ,  H01L2224/45572 ,  H01L2224/45616 ,  H01L2224/45644 ,  H01L2224/48227 ,  H01L2224/48229 ,  H01L2224/4845 ,  H01L2224/48471 ,  H01L2224/48479 ,  H01L2224/48507 ,  H01L2224/78301 ,  H01L2224/81815 ,  H01L2224/8501 ,  H01L2224/85014 ,  H01L2224/85203 ,  H01L2224/85205 ,  H01L2224/85207 ,  H01L2224/85447 ,  H01L2924/00014 ,  H01L2924/14 ,  H01L2924/15747 ,  H01L2924/20105 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2924/01008 ,  H01L2224/45664

Abstract: An apparatus, and methods therefor, relates generally to an integrated circuit package. In such an apparatus, a platform substrate has a copper pad. An integrated circuit die is coupled to the platform substrate. A wire bond wire couples a contact of the integrated circuit die and the copper pad. A first end of the wire bond wire is ball bonded with a ball bond for direct contact with an upper surface of the copper pad. A second end of the wire bond wire is stitch bonded with a stitch bond to the contact.

Abstract translation: 一种装置及其方法一般涉及集成电路封装。 在这种装置中，平台基板具有铜焊盘。 集成电路管芯耦合到平台衬底。 导线接合线将集成电路管芯的触点和铜焊盘相连。 线接合线的第一端用球接合球焊接，以直接接触铜垫的上表面。 线接合线的第二端用针脚接合到接点上。