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公开(公告)号:US20160329294A1
公开(公告)日:2016-11-10
申请号:US14796745
申请日:2015-07-10
申请人: Invensas Corporation
发明人: Willmar SUBIDO , Reynaldo CO , Wael ZOHNI , Ashok S. PRABHU
IPC分类号: H01L23/00 , H01L23/498
CPC分类号: H01L24/48 , H01L24/45 , H01L24/81 , H01L24/85 , H01L2224/05124 , H01L2224/05147 , H01L2224/05155 , H01L2224/05624 , H01L2224/05647 , H01L2224/05655 , H01L2224/05664 , H01L2224/05666 , H01L2224/45147 , H01L2224/45565 , H01L2224/45572 , H01L2224/45616 , H01L2224/45644 , H01L2224/48227 , H01L2224/48229 , H01L2224/4845 , H01L2224/48471 , H01L2224/48479 , H01L2224/48507 , H01L2224/78301 , H01L2224/81815 , H01L2224/8501 , H01L2224/85014 , H01L2224/85203 , H01L2224/85205 , H01L2224/85207 , H01L2224/85447 , H01L2924/00014 , H01L2924/14 , H01L2924/15747 , H01L2924/20105 , H01L2224/45015 , H01L2924/207 , H01L2924/01008 , H01L2224/45664
摘要: An apparatus, and methods therefor, relates generally to an integrated circuit package. In such an apparatus, a platform substrate has a copper pad. An integrated circuit die is coupled to the platform substrate. A wire bond wire couples a contact of the integrated circuit die and the copper pad. A first end of the wire bond wire is ball bonded with a ball bond for direct contact with an upper surface of the copper pad. A second end of the wire bond wire is stitch bonded with a stitch bond to the contact.
摘要翻译: 一种装置及其方法一般涉及集成电路封装。 在这种装置中,平台基板具有铜焊盘。 集成电路管芯耦合到平台衬底。 导线接合线将集成电路管芯的触点和铜焊盘相连。 线接合线的第一端用球接合球焊接,以直接接触铜垫的上表面。 线接合线的第二端用针脚接合到接点上。
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公开(公告)号:US20050184133A1
公开(公告)日:2005-08-25
申请号:US11065193
申请日:2005-02-24
申请人: Horst Clauberg , Ronald Focia , David Beatson , Kenneth Dury
发明人: Horst Clauberg , Ronald Focia , David Beatson , Kenneth Dury
CPC分类号: H01L24/85 , B08B7/0042 , B23K20/004 , B23K26/1224 , B23K26/123 , B23K26/142 , B23K26/1462 , B23K2101/32 , H01L24/45 , H01L24/78 , H01L2224/05554 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/7865 , H01L2224/8501 , H01L2224/85014 , H01L2224/85016 , H01L2224/85205 , H01L2224/85207 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01007 , H01L2924/01013 , H01L2924/01015 , H01L2924/01018 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/0106 , H01L2924/01068 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/12042 , H01L2924/14 , H01L2924/3025 , H01L2224/48 , H01L2924/00
摘要: A wire bonding system for attaching a wire between bonding pads on a semiconductor device and a substrate. The wire bonding system includes a frame and a bonding head attached to the frame and adapted to attach a wire between bonding pads on a semiconductor device and a substrate. The wire bonding system also includes a laser cleaning mechanism mounted to the frame, the laser cleaning mechanism including a laser for emitting laser light adapted to irradiate contaminants on a bonding pad, the laser mechanism located on the frame so as to emit light onto a bonding pad of at least one of the semiconductor device and the substrate prior to the bonding head attaching the wire thereto.
摘要翻译: 一种用于在半导体器件和衬底上的接合焊盘之间连接导线的引线接合系统。 引线接合系统包括框架和粘合头,该接合头附接到框架并且适于将导线附接到半导体器件和基板上的接合焊盘之间。 引线接合系统还包括安装到框架的激光清洁机构,激光清洁机构包括用于发射适合于在接合焊盘上照射污染物的激光的激光器,位于框架上的激光机构以将光发射到接合 所述半导体器件和所述基板中的至少一个的焊盘在所述焊接头附接所述导线之前。
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公开(公告)号:US07476597B2
公开(公告)日:2009-01-13
申请号:US11456404
申请日:2006-07-10
IPC分类号: H01L21/322 , H01L21/44 , H01L21/00
CPC分类号: H01L24/85 , B23K20/007 , B23K26/0006 , B23K26/22 , B23K26/352 , B23K28/02 , B23K2101/40 , B23K2103/08 , B23K2103/10 , B23K2103/12 , H01L24/45 , H01L24/48 , H01L24/78 , H01L2224/05624 , H01L2224/05639 , H01L2224/05644 , H01L2224/05647 , H01L2224/05664 , H01L2224/45015 , H01L2224/45124 , H01L2224/45139 , H01L2224/45144 , H01L2224/45147 , H01L2224/45164 , H01L2224/48091 , H01L2224/48463 , H01L2224/48505 , H01L2224/48624 , H01L2224/48639 , H01L2224/48644 , H01L2224/48647 , H01L2224/48664 , H01L2224/48724 , H01L2224/48739 , H01L2224/48744 , H01L2224/48747 , H01L2224/48764 , H01L2224/48824 , H01L2224/48839 , H01L2224/48844 , H01L2224/48847 , H01L2224/48864 , H01L2224/78268 , H01L2224/78301 , H01L2224/85014 , H01L2224/85016 , H01L2224/85039 , H01L2224/85045 , H01L2224/85205 , H01L2224/85214 , H01L2924/01005 , H01L2924/01013 , H01L2924/01014 , H01L2924/01019 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/0106 , H01L2924/01079 , H01L2924/01082 , H01L2924/01327 , H01L2924/10253 , H01L2924/00014 , H01L2924/00
摘要: The invention provides methods and systems for laser assisted wirebonding. One or more conditioning laser pulses are used to prepare a bonding surface for wirebonding by removing impurities such as residues from manufacturing processes, oxides, or irregularities on the bonding surface. Subsequently, a free air ball is brought into contact with the conditioned bonding surface to form a weld.
摘要翻译: 本发明提供了用于激光辅助引线键合的方法和系统。 使用一个或多个调理激光脉冲来通过去除粘合表面上的制造工艺,氧化物或不规则物的残留物等杂质来制备用于引线接合的接合表面。 随后,使自由空气球与调节的接合表面接触以形成焊缝。
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公开(公告)号:US20080009129A1
公开(公告)日:2008-01-10
申请号:US11456404
申请日:2006-07-10
IPC分类号: H01L21/44
CPC分类号: H01L24/85 , B23K20/007 , B23K26/0006 , B23K26/22 , B23K26/352 , B23K28/02 , B23K2101/40 , B23K2103/08 , B23K2103/10 , B23K2103/12 , H01L24/45 , H01L24/48 , H01L24/78 , H01L2224/05624 , H01L2224/05639 , H01L2224/05644 , H01L2224/05647 , H01L2224/05664 , H01L2224/45015 , H01L2224/45124 , H01L2224/45139 , H01L2224/45144 , H01L2224/45147 , H01L2224/45164 , H01L2224/48091 , H01L2224/48463 , H01L2224/48505 , H01L2224/48624 , H01L2224/48639 , H01L2224/48644 , H01L2224/48647 , H01L2224/48664 , H01L2224/48724 , H01L2224/48739 , H01L2224/48744 , H01L2224/48747 , H01L2224/48764 , H01L2224/48824 , H01L2224/48839 , H01L2224/48844 , H01L2224/48847 , H01L2224/48864 , H01L2224/78268 , H01L2224/78301 , H01L2224/85014 , H01L2224/85016 , H01L2224/85039 , H01L2224/85045 , H01L2224/85205 , H01L2224/85214 , H01L2924/01005 , H01L2924/01013 , H01L2924/01014 , H01L2924/01019 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/0106 , H01L2924/01079 , H01L2924/01082 , H01L2924/01327 , H01L2924/10253 , H01L2924/00014 , H01L2924/00
摘要: The invention provides methods and systems for laser assisted wirebonding. One or more conditioning laser pulses are used to prepare a bonding surface for wirebonding by removing impurities such as residues from manufacturing processes, oxides, or irregularities on the bonding surface. Subsequently, a free air ball is brought into contact with the conditioned bonding surface to form a weld.
摘要翻译: 本发明提供了用于激光辅助引线键合的方法和系统。 使用一个或多个调理激光脉冲来通过去除粘合表面上的制造工艺,氧化物或不规则物的残留物等杂质来制备用于引线接合的接合表面。 随后,使自由空气球与调节的接合表面接触以形成焊缝。
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公开(公告)号:US09761554B2
公开(公告)日:2017-09-12
申请号:US14796745
申请日:2015-07-10
申请人: Invensas Corporation
发明人: Willmar Subido , Reynaldo Co , Wael Zohni , Ashok S. Prabhu
CPC分类号: H01L24/48 , H01L24/45 , H01L24/81 , H01L24/85 , H01L2224/05124 , H01L2224/05147 , H01L2224/05155 , H01L2224/05624 , H01L2224/05647 , H01L2224/05655 , H01L2224/05664 , H01L2224/05666 , H01L2224/45147 , H01L2224/45565 , H01L2224/45572 , H01L2224/45616 , H01L2224/45644 , H01L2224/48227 , H01L2224/48229 , H01L2224/4845 , H01L2224/48471 , H01L2224/48479 , H01L2224/48507 , H01L2224/78301 , H01L2224/81815 , H01L2224/8501 , H01L2224/85014 , H01L2224/85203 , H01L2224/85205 , H01L2224/85207 , H01L2224/85447 , H01L2924/00014 , H01L2924/14 , H01L2924/15747 , H01L2924/20105 , H01L2224/45015 , H01L2924/207 , H01L2924/01008 , H01L2224/45664
摘要: An apparatus, and methods therefor, relates generally to an integrated circuit package. In such an apparatus, a platform substrate has a copper pad. An integrated circuit die is coupled to the platform substrate. A wire bond wire couples a contact of the integrated circuit die and the copper pad. A first end of the wire bond wire is ball bonded with a ball bond for direct contact with an upper surface of the copper pad. A second end of the wire bond wire is stitch bonded with a stitch bond to the contact.
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公开(公告)号:US20090029542A1
公开(公告)日:2009-01-29
申请号:US12240372
申请日:2008-09-29
IPC分类号: H01L21/44
CPC分类号: H01L24/85 , B23K20/007 , B23K26/0006 , B23K26/22 , B23K26/352 , B23K28/02 , B23K2101/40 , B23K2103/08 , B23K2103/10 , B23K2103/12 , H01L24/45 , H01L24/48 , H01L24/78 , H01L2224/05624 , H01L2224/05639 , H01L2224/05644 , H01L2224/05647 , H01L2224/05664 , H01L2224/45015 , H01L2224/45124 , H01L2224/45139 , H01L2224/45144 , H01L2224/45147 , H01L2224/45164 , H01L2224/48091 , H01L2224/48463 , H01L2224/48505 , H01L2224/48624 , H01L2224/48639 , H01L2224/48644 , H01L2224/48647 , H01L2224/48664 , H01L2224/48724 , H01L2224/48739 , H01L2224/48744 , H01L2224/48747 , H01L2224/48764 , H01L2224/48824 , H01L2224/48839 , H01L2224/48844 , H01L2224/48847 , H01L2224/48864 , H01L2224/78268 , H01L2224/78301 , H01L2224/85014 , H01L2224/85016 , H01L2224/85039 , H01L2224/85045 , H01L2224/85205 , H01L2224/85214 , H01L2924/01005 , H01L2924/01013 , H01L2924/01014 , H01L2924/01019 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/0106 , H01L2924/01079 , H01L2924/01082 , H01L2924/01327 , H01L2924/10253 , H01L2924/00014 , H01L2924/00
摘要: The invention provides methods and systems for laser assisted wirebonding. One or more conditioning laser pulses are used to prepare a bonding surface for wirebonding by removing impurities such as residues from manufacturing processes, oxides, or irregularities on the bonding surface. Subsequently, a free air ball is brought into contact with the conditioned bonding surface to form a weld.
摘要翻译: 本发明提供了用于激光辅助引线键合的方法和系统。 使用一个或多个调理激光脉冲来通过去除粘合表面上的制造工艺,氧化物或不规则物的残留物等杂质来制备用于引线接合的接合表面。 随后,使自由空气球与调节的接合表面接触以形成焊缝。
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