公开(公告)号：US20200035582A1

公开(公告)日：2020-01-30

申请号：US16592213

申请日：2019-10-03

Applicant: J-DEVICES CORPORATION

Inventor： Masao HIROBE

IPC: H01L23/367 ,  H01L23/10 ,  H01L23/04 ,  H01L23/00

Abstract: There is provided a semiconductor device including a substrate whose surface is made of an insulation material, a semiconductor chip flip-chip connected on the substrate, and a heat sink bonded to the semiconductor chip via a thermal interface material and fixed to the substrate outside the semiconductor chip, in which the heat sink has a protrusion part protruding toward the substrate and bonded to the substrate via a conductive resin between a part bonded to semiconductor chip and a part fixed to the substrate and the heat sink has a stress absorbing part. According to the present invention, the protrusion part of the heat sink is prevented from being peeled off from the substrate at the part where the protrusion part of the heat sink is bonded to the substrate.

公开(公告)号：US20160233141A1

公开(公告)日：2016-08-11

申请号：US15018563

申请日：2016-02-08

Applicant: J-DEVICES CORPORATION

Inventor： Masao HIROBE

IPC: H01L23/367 ,  H01L23/00 ,  H01L23/373

CPC classification number: H01L23/3675 ,  H01L23/04 ,  H01L23/10 ,  H01L23/3736 ,  H01L23/562 ,  H01L24/13 ,  H01L24/16 ,  H01L24/17 ,  H01L24/29 ,  H01L24/32 ,  H01L24/73 ,  H01L2224/13101 ,  H01L2224/13139 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/16225 ,  H01L2224/2919 ,  H01L2224/29193 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01029 ,  H01L2924/059 ,  H01L2924/10253 ,  H01L2924/10272 ,  H01L2924/1033 ,  H01L2924/14 ,  H01L2924/16153 ,  H01L2924/1616 ,  H01L2924/3511 ,  H01L2924/014 ,  H01L2924/00014 ,  H01L2924/0655 ,  H01L2924/07025 ,  H01L2924/0715 ,  H01L2924/0635 ,  H01L2924/0675 ,  H01L2924/00

Abstract: There is provided a semiconductor device including a substrate whose surface is made of an insulation material, a semiconductor chip flip-chip connected on the substrate, and a heat sink bonded to the semiconductor chip via a thermal interface material and fixed to the substrate outside the semiconductor chip, in which the heat sink has a protrusion part protruding toward the substrate and bonded to the substrate via a conductive resin between a part bonded to semiconductor chip and a part fixed to the substrate and the heat sink has a stress absorbing part. According to the present invention, the protrusion part of the heat sink is prevented from being peeled off from the substrate at the part where the protrusion part of the heat sink is bonded to the substrate.

Abstract translation: 提供了一种半导体器件，其包括其表面由绝缘材料制成的衬底，连接在衬底上的半导体芯片倒装芯片和经由热界面材料接合到半导体芯片的散热器，并且固定到衬底外部的衬底 半导体芯片，其中散热器具有突出部分，突出部分朝向基板突出并且通过导电树脂在接合到半导体芯片的部件和固定到基板的部件之间并且散热器接合到基板上，具有应力吸收部分。 根据本发明，防止散热器的突起部在散热片的突出部分接合到基板的部分处从基板剥离。