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    SUBSTRATE PRODUCTION SIMULATION METHOD
    2.
    发明公开
    SUBSTRATE PRODUCTION SIMULATION METHOD 审中-公开

    公开(公告)号：US20240023303A1

    公开(公告)日：2024-01-18

    申请号：US18251460

    申请日：2020-11-27

    申请人： FUJI CORPORATION

    发明人： Yukitoshi MORITA

    IPC分类号： H05K13/08

    CPC分类号： H05K13/085

    摘要： In a substrate production simulation method, production of a product substrate on which mounting of a component supplied from a component supply device is completed is simulated using a substrate production line including a mounting line in which multiple component mounters for mounting the component on a substrate are arranged. The method includes steps (a) to (c). In the step (a), a first result is obtained by simulation on the assumption that provision and collection of the component supply device with respect to the substrate production line are performed without delay. In the step (b), a second result is obtained by simulation on the assumption that provision and/or collection of the component supply device with respect to the substrate production line is performed by an automated facility and/or a worker. In the step (c), the first result and the second result are output to the same screen in a form indicating a transition of a production number of product substrates with respect to time.

    METHOD AND DEVICE FOR POPULATING CIRCUIT BOARDS BY FIXEDLY ASSIGNED COMPONENTS ON AT LEAST TWO ASSEMBLY LINES
    3.
    发明公开
    METHOD AND DEVICE FOR POPULATING CIRCUIT BOARDS BY FIXEDLY ASSIGNED COMPONENTS ON AT LEAST TWO ASSEMBLY LINES 审中-公开

    公开(公告)号：US20230345689A1

    公开(公告)日：2023-10-26

    申请号：US18015353

    申请日：2020-07-28

    申请人： Siemens Aktiengesellschaft

    发明人： Alexander Pfaffinger ,  Christian Royer

    IPC分类号： H05K13/08 ,  G06Q10/0631 ,  G06Q50/04

    CPC分类号： H05K13/085 ,  G06Q10/06315 ,  G06Q50/04

    摘要： A method for populating circuit boards with a quantity of required component types on at least two assembly lines, wherein fixedly assigned Components can be mounted on each assembly line, wherein the method includes the following steps: a) acquiring circuit board types; b) acquiring component types; c) acquiring fixedly assigned component clusters for each assembly line; d) acquiring circuit board types that can be assigned to a fixedly assigned component cluster for each assembly line; e) acquiring circuit board types that can be assigned to a cluster extension for each fixedly assigned component cluster f) determining an assignment of circuit board types to fixedly assigned component clusters and cluster extensions; and g) optimising the determined assignment until an assignment quality exceeds a predeterminable level.

    Component supply unit arrangement determination method and component mounting system
    4.
    发明授权
    Component supply unit arrangement determination method and component mounting system 有权

    公开(公告)号：US11723184B2

    公开(公告)日：2023-08-08

    申请号：US17254633

    申请日：2018-06-26

    申请人： FUJI CORPORATION

    发明人： Yukihiro Yamashita ,  Yoshihiro Yasui

    IPC分类号： H05K13/08 ,  H05K13/04 ,  H05K13/02

    CPC分类号： H05K13/086 ,  H05K13/02 ,  H05K13/0419 ,  H05K13/085

    摘要： In a component supply unit arrangement determination method for a mounter, in which multiple component supply units are exchangeably arranged and which mounts a component on a board based on a job, as the component supply unit to be exchanged for the component supply unit to be newly arranged due to switching of multiple jobs whose execution order is determined, the component supply unit is selected such that a time interval from a job, in which the component supply unit is to be used last, to the switching is long, among the component supply units that are arranged before the switching and are not planned to be used in a job after the switching. In addition, an arrangement position of the selected component supply unit is determined as an arrangement position of the component supply unit to be newly arranged.

    Electronic circuit component mounting method and mounting system
    5.
    发明授权
    Electronic circuit component mounting method and mounting system 有权

    公开(公告)号：US09955617B2

    公开(公告)日：2018-04-24

    申请号：US14769552

    申请日：2013-02-25

    申请人： FUJI MACHINE MFG. CO., LTD.

    发明人： Mizuho Nozawa

    IPC分类号： H05K13/04 ,  H05K3/30 ,  H05K13/08

    CPC分类号： H05K13/0404 ,  H05K3/30 ,  H05K13/0417 ,  H05K13/043 ,  H05K13/0452 ,  H05K13/08 ,  H05K13/085

    摘要： A mounting method performed by an electronic circuit component mounting machine that includes a tape feeder which is mounting-machine-main-body-side feeder held by a mounting machine main body, and a bulk feeder which is head-side feeder moved to any position on a movement plane covering a circuit-substrate conveying and holding device and the mounting-machine-main-body-side feeder is improved. A reception order is determined, so as to reduce the number of times a mounting head moves between the circuit-substrate conveying and holding device and the mounting-machine-main-body-side feeder and the receiving of first type components supplied from the tape feeder and the receiving of second type components supplied from the bulk feeder are respectively performed together as a batch.

    METHOD AND SYSTEM FOR POPULATING PRINTED CIRCUIT BOARDS
    6.
    发明申请
    METHOD AND SYSTEM FOR POPULATING PRINTED CIRCUIT BOARDS 审中-公开

    公开(公告)号：US20180007794A1

    公开(公告)日：2018-01-04

    申请号：US15542974

    申请日：2015-11-17

    申请人： Siemens Aktiengesellschaft

    发明人： Alexander Pfaffinger ,  Christian Royer

    IPC分类号： H05K3/00 ,  G05B19/418

    CPC分类号： H05K3/0005 ,  G05B19/41865 ,  H05K3/0097 ,  H05K13/085

    摘要： Provided is a method for populating printed circuit boards, which includes the steps of registering jobs in each case relating to the population of a number of printed circuit boards of a printed circuit board type with components of predetermined component types, assigning printed circuit board types of the registered jobs to a predetermined number of fixed set-up families, optimizing the assignment in such a way that a characteristic number relating to all the pick-and-place lines of the pick-and-place system is optimized as far as possible, and populating the printed circuit boards on one of the pick-and-place lines by using one of the fixed set-ups.

    Electronic component mounting system
    7.
    发明授权
    Electronic component mounting system 有权
    电子元件安装系统

    公开(公告)号：US09474194B2

    公开(公告)日：2016-10-18

    申请号：US13992060

    申请日：2011-12-07

    申请人： Takeyuki Kawase ,  Kazuhiko Itose

    发明人： Takeyuki Kawase ,  Kazuhiko Itose

    IPC分类号： H05K13/04 ,  H05K13/08

    CPC分类号： H05K13/0452 ,  H05K13/04 ,  H05K13/08 ,  H05K13/085 ,  Y10T29/4913 ,  Y10T29/53174

    摘要： An electronic component mounting system configured by joining together a plurality of electronic component mounting apparatuses (M2) to (M5*), each of which has a first mounting lane (L1) and a second mounting lane (L2), is configured so as to be able to carry out any one selected from a first operation mode of letting one operation performance mechanism carry out operation performance while taking as a target only a substrate of a substrate conveyance mechanism corresponding to the operation performance mechanism and a second operation mode in which one operation performance mechanism can carry out operation performance while taking as targets all of a plurality of substrates conveyed by a plurality of substrate conveyance mechanisms, and only the two electronic component mounting apparatuses (M5*) each of which is equipped with a tray feeder (30) is brought into the second operation mode.

    摘要翻译： 通过将多个具有第一安装通道（L1）和第二安装通道（L2）的电子部件安装装置（M2）连接到（M5 *）而构成的电子部件安装系统被构造成 能够执行从使一个操作性能机构的第一操作模式中选择的任何一个执行操作性能，同时仅将作为对应于操作性能机构的基板传送机构的基板作为目标，并且其中一个 操作性能机构能够以多个基板输送机构输送的多个基板作为目标，并且只有两个电子部件安装装置（M5 *）分别配备有托盘进给器（30） ）进入第二操作模式。

    Component mounting method
    8.
    发明授权
    Component mounting method 有权
    组件安装方法

    公开(公告)号：US09456505B2

    公开(公告)日：2016-09-27

    申请号：US14116256

    申请日：2012-03-08

    申请人： Masaru Sakamoto

    发明人： Masaru Sakamoto

    IPC分类号： H05K3/30 ,  H05K13/04 ,  H05K13/08 ,  H05K3/00

    CPC分类号： H05K3/301 ,  H05K3/0008 ,  H05K13/0452 ,  H05K13/08 ,  H05K13/085 ,  Y10T29/4913 ,  Y10T29/49778

    摘要： The present invention relates to a setup method for deciding component feeding apparatuses to be attached to each of mounting machines in a component mounting system. The setup method includes a first step of deciding component feeding apparatuses to be attached to each of the mounting machines based on substrate data defining components to be mounted by each of the mounting machines; a second step of determining whether or not there is within the components included in the substrate data a sole mounted component to be mounted by only one mounting machine among the multiple mounting machines; and a third step of deciding, when the determination is made that the sole mounted component exists, to attach component feeding apparatuses feeding the sole mounted component or an alternative component capable of replacing the sole mounted component onto at least one mounting machine other than the only one mounting machine.

    摘要翻译： 本发明涉及一种用于在部件安装系统中确定要安装到每个安装机上的部件供给装置的设置方法。 该设置方法包括：第一步骤，基于基于定义要由每个安装机器安装的部件的基板数据来确定要附接到每个安装机器的部件供给装置; 确定在所述多个安装机中仅由一个安装机安装的唯一安装部件中是否存在包括在所述基板数据中的部件内的第二步骤; 以及第三步骤，当确定存在唯一安装的部件时，将馈送鞋底安装部件的部件进给装置或能够将唯一安装的部件替换到除了唯一安装部件之外的至少一个安装机器的替代部件 一台安装机。

    METHOD FOR EQUIPPING PRINTED CIRCUIT BOARDS
    9.
    发明申请
    METHOD FOR EQUIPPING PRINTED CIRCUIT BOARDS 有权
    装备印刷电路板的方法

    公开(公告)号：US20160143197A1

    公开(公告)日：2016-05-19

    申请号：US14932152

    申请日：2015-11-04

    申请人： ASM Assembly Systems GmbH & Co. KG

    发明人： Franz HEUBERGER ,  Rudolf KIENER ,  Christian MEISSNER

    IPC分类号： H05K13/04 ,  H05K13/08 ,  H05K13/00 ,  H05K3/30

    CPC分类号： H05K13/0495 ,  H05K3/30 ,  H05K13/0015 ,  H05K13/0061 ,  H05K13/08 ,  H05K13/085 ,  Y10T29/49124 ,  Y10T29/49131

    摘要： A method for equipping printed circuit boards on an equipping machine, the printed circuit boards being of a first length, and the equipping machine being realized to equip printed circuit boards of a second length, the second length being more than twice as great as the first length. The equipping machine has an input section (1) and an equipping section (2), the equipping section (2) being disposed after the input section (1) in a direction of conveyance (F) of the printed circuit boards, disposed after the input section (1) in a direction of conveyance of the printed circuit boards, the printed circuit boards of the first length and the printed circuit boards of the second length being transportable, in their longitudinal direction, from the input section (1) into the equipping station (2). According to the method, first printed circuit boards (5) of the first length are stored temporarily in a buffer region (6) of the equipping section (2), and consequently have a shorter transport path to an equipping post (4) of the equipping section (2) than from the input section (1).

    摘要翻译： 一种用于将印刷电路板装配在装备机器上的方法，所述印刷电路板具有第一长度，并且所述装备机器被实现为装备第二长度的印刷电路板，所述第二长度是所述第一长度的两倍以上 长度。 装备机具有输入部分（1）和装备部分（2），装备部分（2）在印刷电路板的输送方向（F）之后设置在输入部分（1）之后， 输入部分（1）沿着印刷电路板的传送方向，第一长度的印刷电路板和第二长度的印刷电路板在其纵向方向上从输入部分（1）输送到 装备站（2）。 根据该方法，将第一长度的第一印刷电路板（5）临时存储在装备部分（2）的缓冲区域（6）中，因此具有较短的到达装备部分（4）的输送路径 装备部分（2）比输入部分（1）。