公开(公告)号：US3819408A

公开(公告)日：1974-06-25

申请号：US23851372

申请日：1972-03-27

Applicant: JAPAN BROADCASTING CORP

Inventor： TOYONAGA R ,  HIRUMA E

IPC: C23C14/04 ,  C23C14/22 ,  H01J9/12 ,  H01J9/233 ,  B44D3/18 ,  B44C1/18

CPC classification number: H01J9/125 ,  C23C14/04 ,  C23C14/22 ,  H01J2201/32

Abstract: A method for manufacturing secondary emission electrode deposited on a thin supporting film by vacuum evaporation, wherein a rigid body is arranged adjacent to a surface of the thin film opposite to the vaporizing surface. The opposite surfaces of the rigid body and the thin film may be arranged in parallel and at a distance, for example, about 0.05 mm or they may be so arranged to increase the distance at locations radially more distant from the central portion of the thin film. An evaporating material is vapor deposited onto the supporting surface, thus a secondary emission electrode layer having a uniform thickness can be obtained.

Abstract translation: 一种制造通过真空蒸发沉积在薄的支撑膜上的二次发射电极的方法，其中刚性体邻近于与蒸发表面相对的薄膜表面设置。 刚体和薄膜的相对表面可以平行布置并且距离例如为约0.05mm，或者它们可以被布置成增加在远离薄膜的中心部分的位置处的距离 。 蒸发材料气相沉积到支撑表面上，因此可以获得具有均匀厚度的二次发射电极层。