公开(公告)号：US20240219461A2

公开(公告)日：2024-07-04

申请号：US18041598

申请日：2021-01-27

Applicant: JENOPTIK Optical Systems GmbH

Inventor： Robert BUETTNER ,  Armin GRUNDMANN ,  Tobias GNAUSCH ,  Thomas KADEN ,  Stefan FRANZ ,  Christian KARRAS

IPC: G01R31/311 ,  G01R31/28

CPC classification number: G01R31/311 ,  G01R31/2887

Abstract: A contacting module and to a method for assembling a contacting module. The contacting module includes: an optical module which contains an optical block made of glass, which optical block has an arrangement of optical interfaces (Sopt) in an optical interface plane (Eopt); and an electronic module, which has an arrangement of electrical interfaces (Sele) in an electrical interface plane (Eele). The optical module and the electronic module are arranged relative to each other such that the arrangement of optical interfaces (Sopt) and the arrangement of electrical interfaces (Sele) have a defined alignment position relative to each other. The optical module contains a mounting plate which is connected to the electronic module by means of a repeatedly releasable, reproducible connection.

公开(公告)号：US20240361542A1

公开(公告)日：2024-10-31

申请号：US18291295

申请日：2022-07-13

Applicant: JENOPTIK Optical Systems GmbH

Inventor： Christian KARRAS ,  Thomas KADEN ,  Tobias GNAUSCH ,  Robert BUETTNER ,  Armin GRUNDMANN

IPC: G02B6/42

CPC classification number: G02B6/4214

Abstract: An optical module for modifying a light beam, wherein the optical module is made of a single-piece solid body material and has a passage surface for receiving the light beam. Furthermore, the optical module comprises a beam deflecting region lying opposite the passage surface for deflecting the light beam, wherein the beam deflecting region is designed as a curved region on the exterior of the optical module, in particular so as to have a hollow mirror function, a pass-through surface for outputting the light beam deflected by the beam deflecting region and a beam shaping region that is designed to shape the light beam and additionally or alternatively thereto the deflected light beam such that the light beam has a beam profile a with homogeneous intensity distribution over a specified range.

公开(公告)号：US20230296668A1

公开(公告)日：2023-09-21

申请号：US18041594

申请日：2021-01-27

Applicant: JENOPTIK Optical Systems GmbH

Inventor： Robert BUETTNER ,  Armin GRUNDMANN ,  Tobias GNAUSCH ,  Thomas KADEN ,  Stefan FRANZ ,  Christian KARRAS

IPC: G01R31/28 ,  G01R31/311 ,  G01R1/07

CPC classification number: G01R31/2887 ,  G01R31/311 ,  G01R1/071

Abstract: A contacting module and a method for assembling a contacting module with an optical module, containing an optical block made of glass, and with an electronics module, the optical block being connected via an adhesive connection to the electronics module or the optical module having a mounting plate, which is mounted on the electronics module so as to be repeatedly releasable therefrom and is connected to the optical block via an adhesive connection. The adhesive connection is produced via at least three cylinder pins, which each have a first end face bearing against the optical block by an adhesive and are glued in through-bores in the carrier plate or the mounting plate.

公开(公告)号：US20240369624A1

公开(公告)日：2024-11-07

申请号：US18287141

申请日：2022-04-12

Applicant: JENOPTIK Optical Systems GmbH

Inventor： Christian KARRAS ,  Tobias GNAUSCH ,  Robert BUETTNER ,  Kay REETZ ,  Armin GRUNDMANN ,  Thomas KADEN

IPC: G01R31/28 ,  G01R31/311

Abstract: A method for testing optoelectronic chips that are arranged on a wafer and comprise electric interfaces in the form of contact pads and optical interfaces, which are arranged in a fixed manner relative to the electric interfaces, in the form of optical deflecting elements, e.g. grating couplers, at a specified coupling angle. In the process, the wafer is adjusted in three adjustment steps in such a manner that one of the chips is positioned relative to a contacting module such that the electric interfaces of the chip and the contacting module are in contact with one another and the optical interfaces of the chip and the contacting module assume a maximum position of the optical coupling.

公开(公告)号：US20230288475A1

公开(公告)日：2023-09-14

申请号：US18041598

申请日：2021-01-27

Applicant: JENOPTIK Optical Systems GmbH

Inventor： Robert BUETTNER ,  Armin GRUNDMANN ,  Tobias GNAUSCH ,  Thomas KADEN ,  Stefan FRANZ ,  Christian KARRAS

IPC: G01R31/311 ,  G01R31/28

CPC classification number: G01R31/311 ,  G01R31/2887

Abstract: A contacting module and to a method for assembling a contacting module. The contacting module includes: an optical module which contains an optical block made of glass, which optical block has an arrangement of optical interfaces (Sopt) in an optical interface plane (Eopt); and an electronic module, which has an arrangement of electrical interfaces (Sele) in an electrical interface plane (Eele). The optical module and the electronic module are arranged relative to each other such that the arrangement of optical interfaces (Sopt) and the arrangement of electrical interfaces (Sele) have a defined alignment position relative to each other. The optical module contains a mounting plate which is connected to the electronic module by means of a repeatedly releasable, reproducible connection.