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公开(公告)号:US10358353B2
公开(公告)日:2019-07-23
申请号:US14908621
申请日:2014-08-01
发明人: Ryo Muraguchi , Miki Egami , Mitsuaki Kumazawa , Masanobu Taniguchi , Tsuguo Koyanagi , Michio Komatsu , Kazutaka Egami
IPC分类号: C01B33/18
摘要: Silica particles calcined in a calcination step are supplied in a swirling flow generated by a gas introduced in a disintegration container and disintegrated therein, whereby the silica particles can be easily disintegrated and there can be obtained disintegrated silica particles having both low hygroscopicity and high dispersibility in resin. In addition, the introduction of dehumidified air (gas) during the disintegration reduces hygroscopicity and greatly improves dispersibility in resin. Furthermore, performing heating treatment (calcination) again after the disintegration causes the surface modification of the disintegrated silica particles, greatly improving hygroscopicity and dispersibility in resin. The resin composition obtained in this manner including silica particles provides good injectability and filterability when used for an underfill material for semiconductors and an in-plane spacer or sealing spacer of liquid crystal displays.
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2.
公开(公告)号:US11613683B2
公开(公告)日:2023-03-28
申请号:US16955290
申请日:2018-12-27
IPC分类号: C09K3/14 , C01B33/18 , B24B37/04 , H01L21/321 , H01L21/768
摘要: There is provided a production method of a chain silica particle dispersion. This production method includes a dispersion preparation step of hydrolyzing alkoxysilane in the presence of ammonia to prepare a silica particle dispersion, an ammonia removal step of removing the ammonia from the silica particle dispersion such that an ammonia amount relative to silica contained in the silica particle dispersion is 0.3% by mass or less, and a hydrothermal treatment step of hydrothermally treating the silica particle dispersion having a silica concentration of 12% by mass or more, from which the ammonia has been removed, at a temperature of not lower than 150° C. and lower than 250° C. An abrasive including such chain silica particles is high in polishing rate and excellent in polishing properties.
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公开(公告)号:US20160159654A1
公开(公告)日:2016-06-09
申请号:US14908621
申请日:2014-08-01
发明人: Ryo Muraguchi , Miki Egami , Mitsuaki Kumazawa , Masanobu Taniguchi , Tsuguo Koyanagi , Michio Komatsu , Kazutaka Egami
IPC分类号: C01B33/18
CPC分类号: C01B33/18
摘要: Silica particles calcined in a calcination step are supplied in a swirling flow generated by a gas introduced in a disintegration container and disintegrated therein, whereby the silica particles can be easily disintegrated and there can be obtained disintegrated silica particles having both low hygroscopicity and high dispersibility in resin. In addition, the introduction of dehumidified air (gas) during the disintegration reduces hygroscopicity and greatly improves dispersibility in resin. Furthermore, performing heating treatment (calcination) again after the disintegration causes the surface modification of the disintegrated silica particles, greatly improving hygroscopicity and dispersibility in resin. The resin composition obtained in this manner including silica particles provides good injectability and filterability when used for an underfill material for semiconductors and an in-plane spacer or sealing spacer of liquid crystal displays.
摘要翻译: 在煅烧步骤中煅烧的二氧化硅颗粒以引入到崩解容器中的气体产生的旋流供给并在其中分解,由此二氧化硅颗粒容易分解,并且可以获得具有低吸湿性和高分散性的崩解二氧化硅颗粒 树脂。 此外,在分解过程中引入除湿空气(气体)降低吸湿性并大大提高树脂中的分散性。 此外,在分解后再次进行加热处理(煅烧)会导致二氧化硅碎片的表面改性,大大提高了树脂中的吸湿性和分散性。 当用于半导体的底部填充材料和液晶显示器的面内间隔物或密封间隔物时,以这种方式获得的包含二氧化硅颗粒的树脂组合物提供了良好的注射性和过滤性。
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