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公开(公告)号:US12129350B2
公开(公告)日:2024-10-29
申请号:US17273232
申请日:2019-09-04
申请人: JSP Corporation
发明人: Tatsuya Hayashi , Akinobu Hira
CPC分类号: C08J9/18 , C08J2377/06
摘要: A polyamide-based resin expanded bead comprising a foam layer formed by expanding a polyamide-based resin, wherein on a first DSC curve and a second DSC curve, the first DSC curve has a melting peak (intrinsic peak) having a peak top temperature on a low temperature side equal to or lower than a peak top temperature of a melting peak of the second DSC curve and a melting peak (high temperature peak) having a peak top temperature on a high temperature side exceeding the peak top temperature of the second DSC curve, and, the peak top temperature of the melting peak of the second DSC curve is 180° C. or higher and 280° C. or lower, and the polyamide-based resin expanded bead has an apparent density of 10 to 300 kg/m3 and a closed cell ratio of 85% or more.
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公开(公告)号:US11952474B2
公开(公告)日:2024-04-09
申请号:US17289169
申请日:2019-10-02
申请人: JSP Corporation
发明人: Shota Takagi , Akinobu Hira
CPC分类号: C08J9/18 , C08J9/0061 , C08J9/228 , C08L53/00 , C08J2203/22 , C08J2353/00 , C08J2423/06 , C08L2203/14
摘要: Expanded beads are those including a mixture of an olefin-based thermoplastic elastomer and a polyethylene-based resin, wherein a melt flow rate MFR(I) of the olefin-based thermoplastic elastomer is 2-10 g/10 min; a difference ((MFR(II))−(MFR(I))) between a melt flow rate MFR(II) of the polyethylene-based resin and the melt flow rate MFR(I) of the olefin-based thermoplastic elastomer is 1-35 g/10 min; and a content of the polyethylene-based resin in the mixture is 3-40% by weight.
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公开(公告)号:US11458710B2
公开(公告)日:2022-10-04
申请号:US17264725
申请日:2019-07-12
申请人: JSP CORPORATION
发明人: Shota Takagi , Akinobu Hira
摘要: A laminated article includes a thermoplastic resin expanded beads molded layer A having a volume Va and a tensile modulus TMa which is 2 to 100 MPa, and a thermoplastic elastomer expanded beads molded layer B having a volume Vb and a tensile modulus TMb which is 0.05 MPa or more and less than 2 MPa, the layers A and B being laminated and bonded to each other. Va:Vb is 90:10 to 50:50 and TMb/TMa is 0.025 or less.
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4.
公开(公告)号:US09410025B2
公开(公告)日:2016-08-09
申请号:US14555967
申请日:2014-11-28
申请人: JSP CORPORATION
发明人: Shota Takagi , Akinobu Hira , Kazutoshi Sasaki
IPC分类号: B32B5/16 , C08J9/228 , B29C44/04 , B29C44/34 , B29C44/44 , C08J9/00 , C08J9/16 , C08J9/224 , C08J9/232
CPC分类号: C08J9/228 , B29C44/04 , B29C44/3461 , B29C44/445 , C08J9/0061 , C08J9/0066 , C08J9/16 , C08J9/224 , C08J9/232 , C08J2323/02 , C08J2323/06 , C08J2323/14 , C08J2323/20 , C08J2423/02 , C08J2423/26 , Y10T428/2998
摘要: An inorganic filler-containing, polyolefin-based resin expanded bead having an expanded core layer of a first polyolefin-based resin, and a cover layer of a second polyolefin-based resin that covers the expanded core layer, wherein a weight ratio of the cover layer to the expanded core layer is 1:99 to 20:80, the expanded core layer contains an inorganic filler in a weight percentage amount of 5 to 90%, and the cover layer contains no inorganic filler or contains an inorganic filler in a weight percentage amount lower than that in the expanded core layer.
摘要翻译: 1.一种无机填料的聚烯烃类树脂发泡珠,其具有第一聚烯烃系树脂的发泡芯层和覆盖所述发泡芯层的第二聚烯烃系树脂的覆盖层,所述覆盖层的重量比 发泡芯层为1:99〜20:80,发泡芯层含有重量百分比为5〜90%的无机填料,覆盖层不含无机填料或含有重量以下的无机填料 百分比低于膨胀核心层的百分比。
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