Polyamide resin foamed particles and method for producing same

    公开(公告)号:US12129350B2

    公开(公告)日:2024-10-29

    申请号:US17273232

    申请日:2019-09-04

    申请人: JSP Corporation

    IPC分类号: C08J9/18 C08J9/16

    CPC分类号: C08J9/18 C08J2377/06

    摘要: A polyamide-based resin expanded bead comprising a foam layer formed by expanding a polyamide-based resin, wherein on a first DSC curve and a second DSC curve, the first DSC curve has a melting peak (intrinsic peak) having a peak top temperature on a low temperature side equal to or lower than a peak top temperature of a melting peak of the second DSC curve and a melting peak (high temperature peak) having a peak top temperature on a high temperature side exceeding the peak top temperature of the second DSC curve, and, the peak top temperature of the melting peak of the second DSC curve is 180° C. or higher and 280° C. or lower, and the polyamide-based resin expanded bead has an apparent density of 10 to 300 kg/m3 and a closed cell ratio of 85% or more.

    Laminated article
    3.
    发明授权

    公开(公告)号:US11458710B2

    公开(公告)日:2022-10-04

    申请号:US17264725

    申请日:2019-07-12

    申请人: JSP CORPORATION

    摘要: A laminated article includes a thermoplastic resin expanded beads molded layer A having a volume Va and a tensile modulus TMa which is 2 to 100 MPa, and a thermoplastic elastomer expanded beads molded layer B having a volume Vb and a tensile modulus TMb which is 0.05 MPa or more and less than 2 MPa, the layers A and B being laminated and bonded to each other. Va:Vb is 90:10 to 50:50 and TMb/TMa is 0.025 or less.