公开(公告)号：US20210364918A1

公开(公告)日：2021-11-25

申请号：US17392435

申请日：2021-08-03

Applicant: JSR CORPORATION

Inventor： Katsuaki Nishikori ,  Shuto Mori ,  Junya Suzuki ,  Hiromitsu Nakashima

IPC: G03F7/004 ,  C08F220/18 ,  C07C381/12 ,  C07C65/05

Abstract: A radiation-sensitive resin composition contains a resin including a structural unit having a phenolic hydroxyl group; and a compound represented by formula (1). In the formula (1), Ar is a substituted or unsubstituted aromatic ring having 6 to 20 carbon atoms; n is an integer of 2 to 4; Z+ is a monovalent onium cation; a plurality of Ys are each independently a polar group; and at least one of the plurality of Ys is an —OH group or an —SH group bonded to a carbon atom adjacent to a carbon atom to which a COO− group is bonded.

公开(公告)号：US10216090B2

公开(公告)日：2019-02-26

申请号：US15082389

申请日：2016-03-28

Applicant: JSR CORPORATION

Inventor： Kanako Meya ,  Yusuke Anno ,  Ken Maruyama ,  Shuto Mori

IPC: G03F7/40 ,  H01L21/027 ,  G03F7/039 ,  G03F7/32

Abstract: A pattern-forming method comprises forming a prepattern that is insoluble or hardly soluble in an organic solvent. A first composition is applied on at least lateral faces of the prepattern to form a resin layer. Adjacent regions to the prepattern of the resin layer are insolubilized or desolubilized in the organic solvent without being accompanied by an increase in a molecular weight by heating the prepattern and the resin layer. Regions other than the adjacent regions insolubilized or desolubilized of the resin layer are removed with the organic solvent. The first composition comprises a first polymer having a solubility in the organic solvent to be decreased by an action of an acid. At least one selected from the following features (i) and (ii) is satisfied: (i) the first polymer comprises a basic group; and (ii) the first composition further comprises a basic compound.