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公开(公告)号：US4810663A
公开(公告)日：1989-03-07
申请号：US260096
申请日：1986-05-06
IPC分类号： H01L21/268 , H01L21/768 , H01L21/265
CPC分类号： H01L21/76894 , H01L21/268
摘要： An integrated circuit device including a link point for electrically connecting a plurality of metal layers, comprising a first metal layer, a link insulating layer and a second metal layer. Diffusion barrier may be employed between the link insulator layer and each of the first metal layer and the second metal layer. The metal layers are connected by exposing the link point to a low-power laser for a relatively long pulse width.
摘要翻译： 一种集成电路装置，包括用于电连接多个金属层的连接点，包括第一金属层，链路绝缘层和第二金属层。 可以在连接绝缘体层和第一金属层和第二金属层中的每一个之间采用扩散阻挡层。 金属层通过将连接点暴露于相对长的脉冲宽度的低功率激光器来连接。
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2.发明授权Method of making a conductive path in multi-layer metal structures by low power laser beam 失效通过低功率激光束在多层金属结构中制造导电路径的方法
公开(公告)号：US4585490A
公开(公告)日：1986-04-29
申请号：US657128
申请日：1984-10-03
IPC分类号： H01L21/268 , H01L21/768 , H01L21/265
CPC分类号： H01L21/268 , H01L21/76894 , Y10S438/94
摘要： An integrated circuit device including a link point for electrically connecting a plurality of metal layers, comprising a first metal layer, a link insulating layer, a second metal layer and diffusion barrier layers between the link insulator layer and each of the first metal layer and the second metal layer. The metal layers are connected by exposing the link point to a low-power laser for a relatively long pulse width.
摘要翻译： 一种集成电路装置，包括用于电连接多个金属层的连接点，包括第一金属层，链路绝缘层，第二金属层和在所述链路绝缘体层与第一金属层和第一金属层中的每一个之间的扩散阻挡层 第二金属层。 金属层通过将连接点暴露于相对长的脉冲宽度的低功率激光器来连接。
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3.发明授权Method and apparatus for forming low resistance lateral links in a semiconductor device 失效用于在半导体器件中形成低电阻横向连杆的方法和装置
公开(公告)号：US4636404A
公开(公告)日：1987-01-13
申请号：US651230
申请日：1984-09-17
IPC分类号： H01L23/525 , B05D3/06 , B05D5/12 , B23K9/00
CPC分类号： H01L23/525 , H01L23/5254 , H01L2924/0002 , Y10S148/14
摘要： A method and apparatus for reliably forming low resistance links between two aluminum conductors deposited on an insulating polysilicon or amorphous silicon layer, employ a laser to bridge a lateral gap between the conductors. The apparatus and method are ideally suited for implementing defect avoidance using redundancy in large random access memories and in complex VLSI circuits. Only a single level of metal is employed and leads to both higher density and lower capacitance in comparison to prior techniques. Resistances in the range of one to ten ohms can be achieved for gap widths of approximately two to three microns.
摘要翻译： 一种用于可靠地形成沉积在绝缘多晶硅或非晶硅层上的两个铝导体之间的低电阻链路的方法和装置，采用激光来桥接导体之间的横向间隙。 该装置和方法理想地适用于在大型随机存取存储器和复杂VLSI电路中使用冗余来实现缺陷回避。 与现有技术相比，只采用单一级别的金属并且导致更高的密度和更低的电容。 对于大约2到3微米的间隙宽度，可实现1至10欧姆范围内的电阻。
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公开(公告)号：US06150940A
公开(公告)日：2000-11-21
申请号：US371800
申请日：1999-08-10
申请人： Glenn H. Chapman , Mark Zaacks
发明人： Glenn H. Chapman , Mark Zaacks
CPC分类号： G08B13/14
摘要： An anti-theft power cord for use with electrical devices has sensors for detecting removal of the cord from an electrical receptacle and for detecting the removal of the cord from the device sought to be protected. Control systems associated with each of the sensors activate alarms when receiving signals from the sensors. The control systems, comprising microcontrollers, also communicate with one another along the power cord and will sound an alarm if the cord is cut. A battery backup system is provided to allow the power cord to function as an anti-theft device even during a power failure without sounding false alarms.
摘要翻译： 用于电气设备的防盗电源线具有用于检测从电插座去除绳索的传感器，并且用于检测从所要保护的设备中去除绳索。 与每个传感器相关联的控制系统在从传感器接收信号时激活报警。 包括微控制器的控制系统也沿着电源线彼此通信，并且如果电缆被切断则会发出警报。 提供电池备用系统，即使在电源故障期间，电源线也可用作防盗设备，而不会发出假警报。
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5.发明授权
公开(公告)号：US5087589A
公开(公告)日：1992-02-11
申请号：US371587
申请日：1989-06-26
申请人： Glenn H. Chapman , Terry O. Herndon
发明人： Glenn H. Chapman , Terry O. Herndon
IPC分类号： H01L21/3205 , H01L21/768 , H01L23/532
CPC分类号： H01L23/53209 , H01L21/76877 , H01L2924/0002 , H01L2924/3011 , Y10S438/921
摘要： A method of fabricating programmable interlayer conductive links in a multilayer integrated circuit structure, comprising the steps of forming elements of either a conductive or semiconductive material as a lower layer, depositing an insulative layer on top of the lower layer elements, implanting ions into one or more link regions of the insulative layer, forming at least one upper conductor over the implanted regions and selectively applying sufficient energy to at least one of the implanted regions of the integrated circuit structure to render the selected link region conductive. The invention also embraces customized integrated circuit structures with interlayer conductive paths made in accordance with this method.
摘要翻译： 一种在多层集成电路结构中制造可编程层间导电链路的方法，包括以下步骤：形成作为下层的导电或半导体材料的元件，在下层元件的顶部上沉积绝缘层，将离子注入到一个或多个 绝缘层的更多连接区域，在注入区域上形成至少一个上导体，并且向集成电路结构的至少一个注入区域选择性地施加足够的能量以使所选择的链路区域导通。 本发明还包括根据该方法制造的具有层间导电路径的定制集成电路结构。
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公开(公告)号：US5726443A
公开(公告)日：1998-03-10
申请号：US588319
申请日：1996-01-18
申请人： Guy B. Immega , Glenn H. Chapman
发明人： Guy B. Immega , Glenn H. Chapman
CPC分类号： G06K9/00033 , G01S17/026 , H03K17/941
摘要： A vision system and proximity detector is provided in the form of an occluding mask with multiple high aspect light pathways positioned over a light detecting surface. Pixel-based images can be generated to provide a vision system utilizing a variety of illumination modes. Proximity can be measured with a triangulating beam.
摘要翻译： 视觉系统和接近检测器被提供为具有位于光检测表面上的多个高方位光通路的闭塞掩模的形式。 可以生成基于像素的图像以提供利用各种照明模式的视觉系统。 接近度可以用三角光束测量。
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公开(公告)号：US07408578B2
公开(公告)日：2008-08-05
申请号：US10425818
申请日：2003-04-30
申请人： Glenn H. Chapman , Yves Audet , Israel Koren , Zahava Koren
发明人： Glenn H. Chapman , Yves Audet , Israel Koren , Zahava Koren
IPC分类号： H04N5/335
CPC分类号： H04N5/3675 , H04N5/367
摘要： An active pixel sensor imaging device comprises array of pixel cells, each pixel cell providing a pixel output signal to a signal output line associated therewith. Each pixel cell comprises: a photosensor having at least two independent portions, each independent portion having a sensor output; and, a separate readout circuit coupled to the sensor output of each independent portion. Each separate readout circuit has an output coupled to the signal output line and each separate readout circuit is capable of generating an output signal at the output. The outputs of the separate readout circuits for the pixel cell are connected such that the output signals are combined in an additive manner to produce the pixel output signal. Hardware and software correction methods are provided for the correction of defective pixels in monochromatic and color imaging systems.
摘要翻译： 有源像素传感器成像装置包括像素单元阵列，每个像素单元向与其相关联的信号输出线提供像素输出信号。 每个像素单元包括：具有至少两个独立部分的光电传感器，每个独立部分具有传感器输出; 以及耦合到每个独立部分的传感器输出的单独读出电路。 每个单独的读出电路具有耦合到信号输出线的输出，并且每个单独的读出电路能够在输出端产生输出信号。 连接用于像素单元的单独读出电路的输出，使得输出信号以加法方式组合以产生像素输出信号。 提供了用于校正单色和彩色成像系统中的缺陷像素的硬件和软件校正方法。
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公开(公告)号：US4843034A
公开(公告)日：1989-06-27
申请号：US194720
申请日：1988-05-23
申请人： Terry O. Herndon , Glenn H. Chapman
发明人： Terry O. Herndon , Glenn H. Chapman
IPC分类号： H01L21/3205 , H01L21/768 , H01L23/532
CPC分类号： H01L23/53209 , H01L21/76877 , H01L2924/0002 , H01L2924/3011 , Y10S438/921
摘要： A method of producing interlayer conductive paths having substantially planar top surfaces in a multilayer integrated circuit structure, comprising the steps of forming elements of either a conductive or semiconductive material as a lower layer, depositing an insulative layer on top of the lower layer elements, implanting ions into one or more selected regions of the insulative layer, forming at least one upper conductor over the selected regions and sintering the integrated circuit structure sufficient to render the selected regions conductive. The invention also embraces an integrated circuit structures with interlayer conductive paths made in accordance with this method.
摘要翻译： 一种在多层集成电路结构中制造具有基本平坦的顶表面的层间导电路径的方法，包括以下步骤：形成作为下层的导电或半导体材料的元件，在下层元件的顶部上沉积绝缘层， 离子进入绝缘层的一个或多个选定区域，在所选择的区域上形成至少一个上导体，并烧结足以使选定区域导电的集成电路结构。 本发明还包括具有根据该方法制造的层间导电路径的集成电路结构。
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