Drill device and method for forming microconduits
    1.
    发明授权
    Drill device and method for forming microconduits 有权
    用于形成微管的钻孔装置和方法

    公开(公告)号:US08241229B2

    公开(公告)日:2012-08-14

    申请号:US12915289

    申请日:2010-10-29

    申请人: Terry O. Herndon

    发明人: Terry O. Herndon

    IPC分类号: A61B5/00

    摘要: The present invention relates to methods and devices for formation of microconduits in tissue, particularly using an impedance sensing drill to form microconduits. One embodiment of the invention is an impedance sensing drill comprising a drilling assembly, a control module, mechanically connected to the drilling assembly for controlling the depth of drilling by the drilling assembly; and a sensor, electrically connected to the drilling assembly and control module for detecting a change in an electrical impedance of a material being drilled. Another embodiment is a method of forming a microconduit in a material, which comprises the steps of drilling into the material, monitoring an electrical impedance of the material, and stopping the drilling into the material when a change in the impedance is detected, thereby forming microconduit.

    摘要翻译: 本发明涉及用于在组织中形成微管的方法和装置,特别是使用阻抗感测钻以形成微管。 本发明的一个实施例是阻抗感测钻头,其包括钻井组件,控制模块,机械地连接到钻井组件,用于控制钻井组件的钻削深度; 以及与钻探组件和控制模块电连接的传感器,用于检测被钻探材料的电阻抗的变化。 另一个实施例是在材料中形成微型管道的方法,其包括以下步骤:在检测到阻抗变化时钻入材料中,监测材料的电阻抗,以及停止钻入材料,从而形成微管 。

    DRILL DEVICE AND METHOD FOR FORMING MICROCONDUITS

    公开(公告)号:US20110040237A1

    公开(公告)日:2011-02-17

    申请号:US12915251

    申请日:2010-10-29

    申请人: TERRY O. HERNDON

    发明人: TERRY O. HERNDON

    IPC分类号: A61N1/30 A61M37/00

    摘要: The present invention relates to methods and devices for formation of microconduits in tissue, particularly using an impedance sensing drill to form microconduits. One embodiment of the invention is an impedance sensing drill comprising a drilling assembly, a control module, mechanically connected to the drilling assembly for controlling the depth of drilling by the drilling assembly; and a sensor, electrically connected to the drilling assembly and control module for detecting a change in an electrical impedance of a material being drilled. Another embodiment is a method of forming a microconduit in a material, which comprises the steps of drilling into the material, monitoring an electrical impedance of the material, and stopping the drilling into the material when a change in the impedance is detected, thereby forming microconduit.

    Unitized Painfree Blood Glucose Measuring Device
    3.
    发明申请
    Unitized Painfree Blood Glucose Measuring Device 审中-公开
    单体化无血糖测量装置

    公开(公告)号:US20090221893A1

    公开(公告)日:2009-09-03

    申请号:US12394139

    申请日:2009-02-27

    申请人: Terry O. Herndon

    发明人: Terry O. Herndon

    IPC分类号: A61B5/00 A61B5/151

    摘要: A blood glucose measuring device is equipped with a drill device, attachment assembly, and disposable sensing and measurement assembly. The attachment assembly contains an attachment ring that connects to the drill device and is used to hold the disposable sensing and measurement assembly. A detach actuating cam and output shaft are attached to the drill device. Spring tongs are attached to the output shaft by a compression ring further clamp to an end cap. A skin penetrator is attached to the end cap. The disposable sensing and measurement assembly is enclosed in a disposable case. An outer telescoping anti-bend tube is attached to the end cap. An inner anti-bend capillary sensor tube contains analyte sensors and is attached to the disposable case. The electrical conductors for the analyte sensor electrodes are attached to the capillary sensor tube and thus to the disposable case. An impedance sensing electrode on the bottom of the case provides electrical contacts to the skin. The electrical conductor to the impedance sensing electrode is attached to the bottom of the disposable case.

    摘要翻译: 血糖测量装置配备有钻孔装置,附件组件和一次性感测和测量组件。 附接组件包括连接到钻孔装置并用于保持一次性感测和测量组件的附接环。 分离致动凸轮和输出轴附接到钻孔装置。 弹簧钳通过压缩环连接到输出轴,进一步夹紧到端盖。 皮肤穿透器连接到端盖。 一次性感测和测量组件被封装在一次性外壳中。 外伸缩式防弯管连接在端盖上。 内部抗弯曲毛细管传感器管包含分析物传感器并附接到一次性外壳。 用于分析物传感器电极的电导体附接到毛细管传感器管,从而连接到一次性外壳。 壳体底部的阻抗感应电极提供与皮肤的电接触。 到阻抗感测电极的电导体连接到一次性外壳的底部。

    Selectively programmable interconnections in multilayer integrated
circuits
    4.
    发明授权
    Selectively programmable interconnections in multilayer integrated circuits 失效
    多层集成电路中的选择性可编程互连

    公开(公告)号:US5087589A

    公开(公告)日:1992-02-11

    申请号:US371587

    申请日:1989-06-26

    摘要: A method of fabricating programmable interlayer conductive links in a multilayer integrated circuit structure, comprising the steps of forming elements of either a conductive or semiconductive material as a lower layer, depositing an insulative layer on top of the lower layer elements, implanting ions into one or more link regions of the insulative layer, forming at least one upper conductor over the implanted regions and selectively applying sufficient energy to at least one of the implanted regions of the integrated circuit structure to render the selected link region conductive. The invention also embraces customized integrated circuit structures with interlayer conductive paths made in accordance with this method.

    摘要翻译: 一种在多层集成电路结构中制造可编程层间导电链路的方法,包括以下步骤:形成作为下层的导电或半导体材料的元件,在下层元件的顶部上沉积绝缘层,将离子注入到一个或多个 绝缘层的更多连接区域,在注入区域上形成至少一个上导体,并且向集成电路结构的至少一个注入区域选择性地施加足够的能量以使所选择的链路区域导通。 本发明还包括根据该方法制造的具有层间导电路径的定制集成电路结构。

    Localized molecular and ionic transport to and from tissues
    5.
    发明授权
    Localized molecular and ionic transport to and from tissues 失效
    局部分子和离子转运到和从组织

    公开(公告)号:US06706032B2

    公开(公告)日:2004-03-16

    申请号:US09878155

    申请日:2001-06-07

    IPC分类号: A61M3100

    摘要: The present invention relates to methods and devices used for the formation of microconduits in a tissue. The term “microconduit” refers to a small opening, channel, or hole into, or through, a tissue, that allows transfer of materials by liquid flow, and by electrophoresis, the microconduit being formed upon impact of a plurality of accelerated microparticles with the surface of the tissue. A method is described for forming at least one microconduit in tissue including the steps of: accelerating a plurality of microparticles to a velocity that causes the microparticles to penetrate a region of tissue surface upon impingement of the microparticles on the tissue surface; and directing the microparticle towards the region of tissue surface, thereby causing the microparticles to penetrate the tissue and form a microconduit in the tissue. According to an embodiment, microparticles are accelerated by being hit with a moving, solid surface. In another embodiment, microparticles are accelerated by a flowing gas or liquid. Also described are methods and devices for using microconduits to deliver therapeutic molecules and ions into tissue, or for extraction of chemical analytes out of tissue. Also described is a method of nail piercing to accommodate jewelry.

    摘要翻译: 本发明涉及用于在组织中形成微管的方法和装置。 术语“微管道”是指通过液体流动允许材料转移并通过电泳的组织中的或通过组织的小的开口,通道或孔,在多个加速的微粒撞击时形成的微管, 组织表面。 描述了一种用于在组织中形成至少一个微管的方法,包括以下步骤:将多个微粒加速到使微粒在组织表面上碰撞时穿透组织表面区域的速度; 并将微粒引向组织表面的区域,从而使微粒穿透组织并在组织中形成微管。 根据一个实施例,通过用移动的固体表面击打微粒被加速。 在另一个实施方案中,微粒被流动的气体或液体加速。 还描述了使用微管道将治疗分子和离子递送到组织中或从组织中提取化学分析物的方法和装置。 还描述了一种钉子穿孔以适应首饰的方法。

    Fabrication of interlayer conductive paths in integrated circuits
    6.
    发明授权
    Fabrication of interlayer conductive paths in integrated circuits 失效
    集成电路中层间导电路径的制作

    公开(公告)号:US4843034A

    公开(公告)日:1989-06-27

    申请号:US194720

    申请日:1988-05-23

    摘要: A method of producing interlayer conductive paths having substantially planar top surfaces in a multilayer integrated circuit structure, comprising the steps of forming elements of either a conductive or semiconductive material as a lower layer, depositing an insulative layer on top of the lower layer elements, implanting ions into one or more selected regions of the insulative layer, forming at least one upper conductor over the selected regions and sintering the integrated circuit structure sufficient to render the selected regions conductive. The invention also embraces an integrated circuit structures with interlayer conductive paths made in accordance with this method.

    摘要翻译: 一种在多层集成电路结构中制造具有基本平坦的顶表面的层间导电路径的方法,包括以下步骤:形成作为下层的导电或半导体材料的元件,在下层元件的顶部上沉积绝缘层, 离子进入绝缘层的一个或多个选定区域,在所选择的区域上形成至少一个上导体,并烧结足以使选定区域导电的集成电路结构。 本发明还包括具有根据该方法制造的层间导电路径的集成电路结构。

    Drill device and method for forming microconduits
    7.
    发明授权
    Drill device and method for forming microconduits 有权
    用于形成微管的钻孔装置和方法

    公开(公告)号:US08636748B2

    公开(公告)日:2014-01-28

    申请号:US12915322

    申请日:2010-10-29

    申请人: Terry O. Herndon

    发明人: Terry O. Herndon

    IPC分类号: A61B17/50

    摘要: The present invention relates to methods and devices for formation of microconduits in tissue, particularly using an impedance sensing drill to form microconduits. One embodiment of the invention is an impedance sensing drill comprising a drilling assembly, a control module, mechanically connected to the drilling assembly for controlling the depth of drilling by the drilling assembly; and a sensor, electrically connected to the drilling assembly and control module for detecting a change in an electrical impedance of a material being drilled. Another embodiment is a method of forming a microconduit in a material, which comprises the steps of drilling into the material, monitoring an electrical impedance of the material, and stopping the drilling into the material when a change in the impedance is detected, thereby forming microconduit.

    摘要翻译: 本发明涉及用于在组织中形成微管的方法和装置,特别是使用阻抗感测钻以形成微管。 本发明的一个实施例是阻抗感测钻头,其包括钻井组件,控制模块,机械地连接到钻井组件,用于控制钻井组件的钻削深度; 以及与钻探组件和控制模块电连接的传感器,用于检测被钻探材料的电阻抗的变化。 另一个实施例是在材料中形成微型管道的方法,其包括以下步骤:在检测到阻抗变化时钻入材料中,监测材料的电阻抗,以及停止钻入材料,从而形成微管 。

    DRILL DEVICE AND METHOD FOR FORMING MICROCONDUITS

    公开(公告)号:US20110046626A1

    公开(公告)日:2011-02-24

    申请号:US12915322

    申请日:2010-10-29

    申请人: Terry O. Herndon

    发明人: Terry O. Herndon

    IPC分类号: A61B17/17 A61B17/16

    摘要: The present invention relates to methods and devices for formation of microconduits in tissue, particularly using an impedance sensing drill to form microconduits. One embodiment of the invention is an impedance sensing drill comprising a drilling assembly, a control module, mechanically connected to the drilling assembly for controlling the depth of drilling by the drilling assembly; and a sensor, electrically connected to the drilling assembly and control module for detecting a change in an electrical impedance of a material being drilled. Another embodiment is a method of forming a microconduit in a material, which comprises the steps of drilling into the material, monitoring an electrical impedance of the material, and stopping the drilling into the material when a change in the impedance is detected, thereby forming microconduit.

    MECHANICAL VEIN LIFTER
    9.
    发明申请
    MECHANICAL VEIN LIFTER 审中-公开
    机械维修

    公开(公告)号:US20100100119A1

    公开(公告)日:2010-04-22

    申请号:US12253317

    申请日:2008-10-17

    申请人: Terry O. Herndon

    发明人: Terry O. Herndon

    IPC分类号: A61B17/00

    摘要: Devices for applying an intermittent pressure to a skin surface are provided. The device includes a housing, a drive mechanism at least partially disposed within the housing, and a pressing portion operatively coupled to the drive mechanism. The pressing portion may include at least one pressing element configured for applying pressure to the surface. The pressing portion is configured to be driven by the drive mechanism between a first configuration having a maximum extension and a second configuration having a minimum extension. The difference between the maximum and minimum extensions is greater than or equal to 0.025 inches. The pressing portion may include a series of rollers to press and squeeze the skin and underlying vein, to create a pumping action, thus pressurizing the vein. The vein expands and presses upward against the skin, thus becoming more visible.

    摘要翻译: 提供了向皮肤表面施加间歇压力的装置。 该装置包括壳体,至少部分地设置在壳体内的驱动机构和可操作地联接到驱动机构的按压部分。 按压部分可以包括构造成用于向表面施加压力的至少一个按压元件。 按压部构造成由具有最大延伸的第一构造和具有最小延伸的第二构造的驱动机构驱动。 最大和最小延伸之间的差异大于或等于0.025英寸。 按压部分可以包括一系列辊以压迫和挤压皮肤和下面的静脉,以产生泵送作用,从而对静脉加压。 静脉膨胀并向上压向皮肤,从而变得更加明显。

    Integrated circuit packaging
    10.
    发明授权
    Integrated circuit packaging 失效
    集成电路封装

    公开(公告)号:US4027383A

    公开(公告)日:1977-06-07

    申请号:US596472

    申请日:1975-07-16

    摘要: Lead connections and packaging for integrated circuits are formed by processing elongated ribbon arrays of integrated circuit dice in groups prior to cutting the ribbon along its length to free the discrete integrated circuit products. The ribbon is adhered to the base of an elongated channel having at least one leg containing implanted lead-in conductors arranged therein as an axial series of axial arrays of conductors. The axial arrays are aligned with the circuits on the ribbons and interconnections therebetween are formed as photolithographically defined conductive coatings on a top surface of the ribbon extending from bonding pads of the integrated circuit to exposed conductor ends at a top end(s) of the leg(s). The channel ribbon assembly is cut into discrete circuits after forming such interconnections for all the circuits of the ribbon as a group. Each array of lead-in conductors is packed in high density and fans out from the channel to an array of low density lead-out conductors which may be plugged into sockets or otherwise macroscopically treated.

    摘要翻译: 用于集成电路的引线连接和封装通过在沿着其长度切割带之前处理集成电路芯片的细长带阵列而形成,以释放分立的集成电路产品。 带状物被粘附到细长通道的基部,该细长通道具有至少一个支脚,其中包含作为导向轴向排列的轴向排列的植入导入导体。 轴向阵列与带上的电路对准,并且它们之间的互连形成为在从集成电路的焊盘延伸到在腿部的顶端处的暴露导体端部的带的顶表面上的光刻定义的导电涂层 (s)。 在将带状物的所有电路作为一组形成这种互连之后,将通道带组件切割成离散电路。 每个引入导体阵列以高密度封装,并从通道中排出风扇到一组低密度导出导体,可插入插座或以其他方式进行宏观处理。