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公开(公告)号:US5084604A
公开(公告)日:1992-01-28
申请号:US521207
申请日:1990-05-07
申请人: Jacob N. Dekker , Maarten H. Zonneveld , Ireneus H. T. Fierkens , Theodorus J. M. J. van Gennip , Peter L. Holster
发明人: Jacob N. Dekker , Maarten H. Zonneveld , Ireneus H. T. Fierkens , Theodorus J. M. J. van Gennip , Peter L. Holster
CPC分类号: B28D1/221 , B23K26/40 , B26F3/06 , C03B33/04 , C03B33/09 , C03B33/091 , B23K2203/50
摘要: The invention relates to a method of asymmetrically severing a plate (3) of brittle material, in which by means of a heat source (5) a thermal load is provided along a heating track asymmetrically with respect to the desired cutting line (7) and the plate (3) is severed along the desired cutting line (7).
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2.
公开(公告)号:US5132505A
公开(公告)日:1992-07-21
申请号:US664073
申请日:1991-03-04
申请人: Maarten H. Zonneveld , Jacobus N. Dekker , Gerrit C. Verkade , Ireneus H. T. Fierkens , Theodorus J. M. J. Van Gennip
发明人: Maarten H. Zonneveld , Jacobus N. Dekker , Gerrit C. Verkade , Ireneus H. T. Fierkens , Theodorus J. M. J. Van Gennip
CPC分类号: G02F1/133351 , B23K26/0821 , B23K26/40 , B28D1/221 , C03B33/091 , B23K2203/50
摘要: A method and a device for cleaving a plate of a brittle material, such as, for example, glass, by means of a radiation beam repeatedly moving over the plate. The radiation beam is repeatedly passed over a desired track until the plate has been cleaved along a desired line of rupture of the plate.
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