摘要:
Example embodiments are directed to a bandwidth synchronization circuit and a bandwidth synchronization method. The bandwidth synchronization circuit includes an upsizer and a syncdown unit. The upsizer includes a sync packer and a sync unpacker operating according to a first clock. The syncdown unit is connected to the upsizer and performs a syncdown operation on data of the upsizer in response to a second clock of a frequency lower than a frequency of the first clock.
摘要:
Example embodiments are directed to a bandwidth synchronization circuit and a bandwidth synchronization method. The bandwidth synchronization circuit includes an upsizer and a syncdown unit. The upsizer includes a sync packer and a sync unpacker operating according to a first clock. The syncdown unit is connected to the upsizer and performs a syncdown operation on data of the upsizer in response to a second clock of a frequency lower than a frequency of the first clock.
摘要:
A system-on-a-chip semiconductor device comprises a first master device configured to issue a request having a transaction ID, a plurality of slave devices configured to provide data in response to the request, and an interconnector configured to include a slave interface for providing the request to one or more master interfaces and for supplying response data to the first master device based on operation characteristics of the first master.An arbitration method of an interconnector transferring a plurality of response data provided from a plurality of slave devices to a master device comprises selecting one of a plurality of arbitration modes based on operation characteristics of the master device; and transferring the response data in the order determined by transfer priority corresponding to the selected arbitration mode.
摘要:
At least one example embodiment discloses a System on Chip (SoC). The SoC includes a master block, a plurality of slave blocks configured to operate in response to a request from the master block, and an interconnect block configured to deliver transactions occurring in the master block to the plurality of slave blocks through a plurality of transfer paths. The interconnect block is configured to monitor load information of the plurality of transfer paths and select one of the plurality of transfer paths according to the load information.
摘要:
A system-on-a-chip semiconductor device comprises a first master device configured to issue a request having a transaction ID, a plurality of slave devices configured to provide data in response to the request, and an interconnector configured to include a slave interface for providing the request to one or more master interfaces and for supplying response data to the first master device based on operation characteristics of the first master.An arbitration method of an interconnector transferring a plurality of response data provided from a plurality of slave devices to a master device comprises selecting one of a plurality of arbitration modes based on operation characteristics of the master device; and transferring the response data in the order determined by transfer priority corresponding to the selected arbitration mode.
摘要:
An asynchronous upsizing circuit in a data processing system. The asynchronous upsizing circuit includes an asynchronous packer and an asynchronous unpacker. The asynchronous packer includes a write buffer commonly used for an asynchronous bridge and for upsizing and for buffering a write channel data; and first and second asynchronous packing controllers controlling channel compaction according to first and second clocks, respectively, regarding the write channel data inputted/outputted to/from the write buffer during a burst write operation. The asynchronous unpacker includes a read buffer commonly used for an asynchronous bridge and for upsizing and for buffering a read channel data; and first and second asynchronous unpacking controllers controlling channel compaction according to the first and second clocks, respectively, regarding the read channel data inputted/outputted to/from the read buffer during a burst read operation.
摘要:
An asynchronous upsizing circuit in a data processing system. The asynchronous upsizing circuit includes an asynchronous packer and an asynchronous unpacker. The asynchronous packer includes a write buffer commonly used for an asynchronous bridge and for upsizing and for buffering a write channel data; and first and second asynchronous packing controllers controlling channel compaction according to first and second clocks, respectively, regarding the write channel data inputted/outputted to/from the write buffer during a burst write operation. The asynchronous unpacker includes a read buffer commonly used for an asynchronous bridge and for upsizing and for buffering a read channel data; and first and second asynchronous unpacking controllers controlling channel compaction according to the first and second clocks, respectively, regarding the read channel data inputted/outputted to/from the read buffer during a burst read operation.