-
1.发明申请Adhesive of a silicon and silica composite for bonding together silicon parts 有权用于将硅部件粘合在一起的硅和二氧化硅复合材料的粘合剂公开(公告)号：US20060213601A1
公开(公告)日：2006-09-28
申请号：US11444560
申请日：2006-06-01
申请人： James Boyle , Raanan Zehavi , Amnon Chalzel
发明人： James Boyle , Raanan Zehavi , Amnon Chalzel
IPC分类号： C03B29/00
CPC分类号： H01L21/67306 , Y10T428/24174 , Y10T428/25 , Y10T428/252 , Y10T428/26
摘要： A method of joining two silicon members, the adhesive used for the method, and the joined product, especially a silicon tower for supporting multiple silicon wafers. A flowable adhesive is prepared comprising silicon particles of size less than 100 μm and preferably less than 100 nm and a silica bridging agent, such as a spin-on glass. Nano-silicon crystallites of about 20 nm size may be formed by CVD. Larger particles may be milled from virgin polysilicon. If necessary, a retardant such as a heavy, preferably water-insoluble alcohol such as terpineol is added to slow setting of the adhesive at room temperature. The mixture is applied to the joining areas. The silicon parts are assembled and annealed at a temperature sufficient to link the silica, preferably at 900° C. to 1100° C. for nano-silicon but higher for milled silicon.
摘要翻译： 连接两个硅构件的方法，用于该方法的粘合剂，以及连接的产品，特别是用于支撑多个硅晶片的硅塔。 制备包含尺寸小于100μm，优选小于100nm的硅颗粒的可流动粘合剂和二氧化硅桥接剂，例如旋涂玻璃。 可以通过CVD形成约20nm尺寸的纳米硅微晶。 更大的颗粒可以从原生多晶硅研磨。 如果需要，加入阻燃剂如重质，优选水不溶性醇如萜品醇，以在室温下缓慢固化粘合剂。 将混合物施加到接合区域。 将硅部件在足以连接二氧化硅的温度下组装和退火，优选在900℃至1100℃下进行纳米硅，但对于研磨的硅而言更高。
-
2.发明授权Assembly of silicon parts bonded together with a silicon and silica composite 有权组装与硅和二氧化硅复合材料结合在一起的硅部件公开(公告)号：US08268448B2
公开(公告)日：2012-09-18
申请号：US12685542
申请日：2010-01-11
申请人： James E. Boyle , Raanan Zehavi , Amnon Chalzel
发明人： James E. Boyle , Raanan Zehavi , Amnon Chalzel
CPC分类号： H01L21/67306 , Y10T428/24174 , Y10T428/25 , Y10T428/252 , Y10T428/26
摘要： A method of joining two silicon members, the adhesive used for the method, and the joined product, especially a silicon tower for supporting multiple silicon wafers. A flowable adhesive is prepared comprising silicon particles of size less than 100 μm and preferably less than 100 nm and a silica bridging agent, such as a spin-on glass. Nano-silicon crystallites of about 20 nm size maybe formed by CVD. Larger particles maybe milled from virgin polysilicon. If necessary, a retardant such as a heavy, preferably water-insoluble alcohol such as terpineol is added to slow setting of the adhesive at room temperature. The mixture is applied to the joining areas. The silicon parts are assembled and annealed at a temperature sufficient to link the silica, preferably at 900° C. to 1100° C. for nano-silicon but higher for milled silicon.
摘要翻译： 连接两个硅构件的方法，用于该方法的粘合剂，以及连接的产品，特别是用于支撑多个硅晶片的硅塔。 制备包含尺寸小于100μm且优选小于100nm的硅颗粒的可流动粘合剂和二氧化硅桥接剂，例如旋涂玻璃。 可以通过CVD形成约20nm尺寸的纳米硅微晶。 更大的颗粒可以从原生多晶硅研磨。 如果需要，加入阻燃剂如重质，优选水不溶性醇如萜品醇，以在室温下缓慢固化粘合剂。 将混合物施加到接合区域。 将硅部件在足以连接二氧化硅的温度下组装和退火，优选在900℃至1100℃下进行纳米硅，但对于研磨的硅而言更高。
-
3.发明申请Assembly of silicon parts bonded together with a silicon and silica composite 有权组装与硅和二氧化硅复合材料结合在一起的硅部件公开(公告)号：US20100119817A1
公开(公告)日：2010-05-13
申请号：US12685542
申请日：2010-01-11
申请人： James E. Boyle , Raanan Zehavi , Amnon Chalzel
发明人： James E. Boyle , Raanan Zehavi , Amnon Chalzel
CPC分类号： H01L21/67306 , Y10T428/24174 , Y10T428/25 , Y10T428/252 , Y10T428/26
摘要： A method of joining two silicon members, the adhesive used for the method, and the joined product, especially a silicon tower for supporting multiple silicon wafers. A flowable adhesive is prepared comprising silicon particles of size less than 100 μm and preferably less than 100 nm and a silica bridging agent, such as a spin-on glass. Nano-silicon crystallites of about 20 nm size maybe formed by CVD. Larger particles maybe milled from virgin polysilicon. If necessary, a retardant such as a heavy, preferably water-insoluble alcohol such as terpineol is added to slow setting of the adhesive at room temperature. The mixture is applied to the joining areas. The silicon parts are assembled and annealed at a temperature sufficient to link the silica, preferably at 900° C. to 1100° C. for nano-silicon but higher for milled silicon.
摘要翻译： 连接两个硅构件的方法，用于该方法的粘合剂，以及连接的产品，特别是用于支撑多个硅晶片的硅塔。 制备包含尺寸小于100μm且优选小于100nm的硅颗粒的可流动粘合剂和二氧化硅桥接剂，例如旋涂玻璃。 可以通过CVD形成约20nm尺寸的纳米硅微晶。 更大的颗粒可以从原生多晶硅研磨。 如果需要，加入阻燃剂如重质，优选水不溶性醇如萜品醇，以在室温下缓慢固化粘合剂。 将混合物施加到接合区域。 将硅部件在足以连接二氧化硅的温度下组装和退火，优选在900℃至1100℃下进行纳米硅，但对于研磨的硅而言更高。
-
4.发明授权Adhesive of a silicon and silica composite for bonding together silicon parts 有权用于将硅部件粘合在一起的硅和二氧化硅复合材料的粘合剂公开(公告)号：US07666513B2
公开(公告)日：2010-02-23
申请号：US11444560
申请日：2006-06-01
申请人： James E. Boyle , Raanan Zehavi , Amnon Chalzel
发明人： James E. Boyle , Raanan Zehavi , Amnon Chalzel
CPC分类号： H01L21/67306 , Y10T428/24174 , Y10T428/25 , Y10T428/252 , Y10T428/26
摘要： A method of joining two silicon members, the adhesive used for the method, and the joined product, especially a silicon tower for supporting multiple silicon wafers. A flowable adhesive is prepared comprising silicon particles of size less than 100 μm and preferably less than 100 nm and a silica bridging agent, such as a spin-on glass. Nano-silicon crystallites of about 20 nm size may be formed by CVD. Larger particles may be milled from virgin polysilicon. If necessary, a retardant such as a heavy, preferably water-insoluble alcohol such as terpineol is added to slow setting of the adhesive at room temperature. The mixture is applied to the joining areas. The silicon parts are assembled and annealed at a temperature sufficient to link the silica, preferably at 900° C. to 1100° C. for nano-silicon but higher for milled silicon.
摘要翻译： 连接两个硅构件的方法，用于该方法的粘合剂，以及连接的产品，特别是用于支撑多个硅晶片的硅塔。 制备包含尺寸小于100μm且优选小于100nm的硅颗粒的可流动粘合剂和二氧化硅桥接剂，例如旋涂玻璃。 可以通过CVD形成约20nm尺寸的纳米硅微晶。 更大的颗粒可以从原生多晶硅研磨。 如果需要，加入阻燃剂如重质，优选水不溶性醇如萜品醇，以在室温下缓慢固化粘合剂。 将混合物施加到接合区域。 将硅部件在足以连接二氧化硅的温度下组装和退火，优选在900℃至1100℃下进行纳米硅，但对于研磨的硅而言更高。
-
5.发明授权Adhesive of a silicon and silica composite particularly useful for joining silicon parts 有权特别适用于连接硅部件的硅和二氧化硅复合材料的粘合剂公开(公告)号：US07083694B2
公开(公告)日：2006-08-01
申请号：US10670990
申请日：2003-09-25
申请人： James E. Boyle , Raanan Zehavi , Amnon Chalzel
发明人： James E. Boyle , Raanan Zehavi , Amnon Chalzel
CPC分类号： H01L21/67306 , Y10T428/24174 , Y10T428/25 , Y10T428/252 , Y10T428/26
摘要： A method of joining two silicon members, the adhesive used for the method, and the joined product, especially a silicon tower for supporting multiple silicon wafers. A flowable adhesive is prepared comprising silicon particles of size less than 100 μm and preferably less than 100 nm and a silica bridging agent, such as a spin-on glass. Nano-silicon crystallites of about 20 nm size may be formed by CVD. Larger particles may be milled from virgin polysilicon. If necessary, a retardant such as a heavy, preferably water-insoluble alcohol such as terpineol is added to slow setting of the adhesive at room temperature. The mixture is applied to the joining areas. The silicon parts are assembled and annealed at a temperature sufficient to link the silica, preferably at 900° C. to 1100° C. for nano-silicon but higher for milled silicon.
摘要翻译： 连接两个硅构件的方法，用于该方法的粘合剂，以及连接的产品，特别是用于支撑多个硅晶片的硅塔。 制备包含尺寸小于100μm，优选小于100nm的硅颗粒的可流动粘合剂和二氧化硅桥接剂，例如旋涂玻璃。 可以通过CVD形成约20nm尺寸的纳米硅微晶。 更大的颗粒可以从原生多晶硅研磨。 如果需要，加入阻燃剂如重质，优选水不溶性醇如萜品醇，以在室温下缓慢固化粘合剂。 将混合物施加到接合区域。 将硅部件在足以连接二氧化硅的温度下组装和退火，优选在900℃至1100℃下进行纳米硅，但对于研磨的硅而言更高。
-
-
-
-
搜索结果
5 条记录 (耗时 0.016 秒)
